Abstract: A wafer transfer device includes a base, a plurality of fixed rings, a rotating shaft, a turntable, an air suction pump and a driving mechanism. The fixed rings are stacked sequentially and each has a channel and a ring groove. The channel is extended from an outer periphery of the fixed ring and communicates to the ring groove. The rotating shaft is connected to each fixed ring and has a plurality of flow passages corresponding to the fixed rings and communicating to the ring groove. The turntable is fixedly connected to the rotating shaft. The air suction pump sucks each wafer, and the driving mechanism drives and rotates the turntable and the rotating shaft, so that each flow passage rotates relative to each fixed ring and keeps communicating with each ring groove to maintain the suction of each wafer.