Patents by Inventor Tsann Huei LEE

Tsann Huei LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor substrate and method of manufacturing the same
    Patent number: 10916492
    Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: February 9, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tsann Huei Lee, Lu-Ming Lai
  • SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190348351
    Abstract: A semiconductor substrate and a method of manufacturing the same are provided. The semiconductor substrate includes a carrier and a conductive post. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The carrier has a through hole extending between the first surface and the second surface. The carrier has a first opening on the lateral surface. The conductive post is disposed within the through hole.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 14, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tsann Huei LEE, Lu-Ming LAI