Patents by Inventor Tse-An Chu

Tse-An Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250004511
    Abstract: An information handling system includes a hardware processor and an embedded controller (EC), an installed cooling fan with an identification hardware gasket of a plurality of hardware gaskets where the embedded controller executes computer readable program code of a hardware fan configuration detection system to detect a type of the installed cooling fan within the information handling system via a hardware fan detection circuit. The hardware fan detection circuit includes a resistor network operatively coupled to the EC and a plurality of PCB contact pads operatively coupled along the resistor network, where placement of the identification hardware gasket of the installed cooling fan on a first PCB contact pad of the plurality of PCB contact pads identifies the installed cooling fan by generating a fan contact signal for selection of a fan operation table to operate the installed cooling fan.
    Type: Application
    Filed: June 27, 2023
    Publication date: January 2, 2025
    Applicant: Dell Products, LP
    Inventors: Shao-Ku Huang, Adolfo S. Montero, Tse-An Chu, Hao-Wu Yang
  • Patent number: 11755094
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: September 12, 2023
    Assignee: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Patent number: 11669143
    Abstract: In one embodiment, a method for managing a dynamic total power level for an information handling system includes: identifying, by a power manager of the information handling system, a first power level associated with a processor subsystem of the information handling system, the first power level based on a cooling capacity associated with the information handling system; identifying, by the power manager, a second power level associated with a graphics processing unit of the information handling system, the second power level based on a performance associated with the processor subsystem; determining, by the power manager, the dynamic total power level based on the first power level and the second power level; and modifying, by the power manager, a fixed total power level based on the dynamic total power level, the dynamic total power level causing the processor subsystem and the GPU to operate within the dynamic total power level.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: June 6, 2023
    Assignee: Dell Products L.P.
    Inventors: Qinghong He, Tse An Chu, Thomas A. Shows, Travis C. North
  • Publication number: 20230126809
    Abstract: In one embodiment, a method for managing a dynamic total power level for an information handling system includes: identifying, by a power manager of the information handling system, a first power level associated with a processor subsystem of the information handling system, the first power level based on a cooling capacity associated with the information handling system; identifying, by the power manager, a second power level associated with a graphics processing unit of the information handling system, the second power level based on a performance associated with the processor subsystem; determining, by the power manager, the dynamic total power level based on the first power level and the second power level; and modifying, by the power manager, a fixed total power level based on the dynamic total power level, the dynamic total power level causing the processor subsystem and the GPU to operate within the dynamic total power level.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 27, 2023
    Inventors: Qinghong He, Tse An Chu, Thomas A. Shows, Travis C. North
  • Publication number: 20220253123
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 11, 2022
    Applicant: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Patent number: 11320885
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: May 3, 2022
    Assignee: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Publication number: 20210373642
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Application
    Filed: May 26, 2020
    Publication date: December 2, 2021
    Applicant: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Patent number: 10936028
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Patent number: 10859326
    Abstract: A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: December 8, 2020
    Assignee: Dell Products L.P.
    Inventors: Ting-Chiang Huang, Tse-An Chu
  • Publication number: 20200217598
    Abstract: A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.
    Type: Application
    Filed: January 9, 2019
    Publication date: July 9, 2020
    Applicant: Dell Products L.P.
    Inventors: Ting-Chiang Huang, Tse-An Chu
  • Publication number: 20190059177
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.
    Type: Application
    Filed: February 12, 2018
    Publication date: February 21, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh
  • Publication number: 20180228050
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Application
    Filed: December 27, 2017
    Publication date: August 9, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Publication number: 20170034901
    Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
  • Publication number: 20140076529
    Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
    Type: Application
    Filed: September 2, 2013
    Publication date: March 20, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
  • Patent number: 8305758
    Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 6, 2012
    Assignee: Compal Electronics, Inc.
    Inventors: Tse-An Chu, Chang-Yuan Wu
  • Publication number: 20110043998
    Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
    Type: Application
    Filed: August 23, 2010
    Publication date: February 24, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tse-An Chu, Chang-Yuan Wu