Patents by Inventor Tse-An Chu

Tse-An Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220253123
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Application
    Filed: April 28, 2022
    Publication date: August 11, 2022
    Applicant: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Patent number: 11320885
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: May 3, 2022
    Assignee: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Publication number: 20210373642
    Abstract: A system for controlling an information handling system is disclosed that includes a central processing unit, a memory device, a power supply and a memory speed controller configured to determine one or more system parameters of the central processing unit, the memory device and the power supply, to store a boot setting as a function of the one or more system parameters and to cause a system reboot after storing the boot setting.
    Type: Application
    Filed: May 26, 2020
    Publication date: December 2, 2021
    Applicant: DELL PRODUCTS L.P.
    Inventors: Chunge-Wei Wang, Chihchung Lin, Tse-An- Chu, Shih-Wei Yang, Yi Ling Tsai
  • Patent number: 10936028
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Patent number: 10859326
    Abstract: A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: December 8, 2020
    Assignee: Dell Products L.P.
    Inventors: Ting-Chiang Huang, Tse-An Chu
  • Publication number: 20200217598
    Abstract: A heatsink may include multiple fin portions soldered together. The fin portions may have stair-stepped surfaces that provide improved thermal dissipation over conventional singular block heatsinks. The portions may be made of different materials, which can allow the heatsink to be made of materials that can be manufactured thinner. The thinner fins can further improve thermal dissipation performance.
    Type: Application
    Filed: January 9, 2019
    Publication date: July 9, 2020
    Applicant: Dell Products L.P.
    Inventors: Ting-Chiang Huang, Tse-An Chu
  • Publication number: 20190059177
    Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.
    Type: Application
    Filed: February 12, 2018
    Publication date: February 21, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh
  • Publication number: 20180228050
    Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
    Type: Application
    Filed: December 27, 2017
    Publication date: August 9, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
  • Publication number: 20170034901
    Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 2, 2017
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
  • Publication number: 20140076529
    Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
    Type: Application
    Filed: September 2, 2013
    Publication date: March 20, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
  • Patent number: 8305758
    Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 6, 2012
    Assignee: Compal Electronics, Inc.
    Inventors: Tse-An Chu, Chang-Yuan Wu
  • Publication number: 20110043998
    Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
    Type: Application
    Filed: August 23, 2010
    Publication date: February 24, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tse-An Chu, Chang-Yuan Wu
  • Publication number: 20060022374
    Abstract: A processing method for making column-shaped foam includes a first step of preparing long-shaped square foam preset in shape. The long-shaped square foam is positioned on the material-feeding device of a planing machine to be planed. The planing device is pivotally fixed with a rotary knife base fitted thereon with plural planing knives of different lengths and having planing positions. When the long-shaped square foam is pushed to the knife base to be planed, the planing knives will carry out planing in sequence, able to quickly plane the long-shaped square foam into column-shaped foam with a smooth circumferential surface. The column-shaped foam made in this way has excellent functions of floating on water, shock absorption and buffering, able to be employed for making various related products.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 2, 2006
    Inventors: Ching Chen, Hung-Tse Chu
  • Publication number: 20060025028
    Abstract: A bridle device for a surfboard includes a flexible rope having its lower end connected with an engage member with an arc-shaped projecting surface. A rope-fitting holder is threadably combined with a connecting base of a board body, having a center hollow. The center hollow has its upper and lower end respectively formed with a small-diameter and a large-diameter hole, the small-diameter hole having its inner wall formed with an arc-shaped recessed surface. The flexible rope has its lower end and its engage member inserted in the rope fitting holder respectively through the small-diameter and the large-diameter hole, letting the arc-shaped projecting surface of the engage member push against the arc-shaped recessed surface in the inner wall of the small-diameter hole. Thus, the flexible rope and the rope-fitting holder can interact to perform three-dimensional turning of 360 degrees.
    Type: Application
    Filed: July 28, 2004
    Publication date: February 2, 2006
    Inventors: Ching Chen, Hung-Tse Chu
  • Patent number: 6168694
    Abstract: Metal nitride, carbonitride, and oxycarbonitride powder with high surface area (up to 150 m2/g) is prepared by using sol-gel process. The metal organic precursor, alkoxides or amides, is synthesized firstly. The metal organic precursor is modified by using unhydrolyzable organic ligands or templates. A wet gel is formed then by hydrolysis and condensation process. The solvent in the wet gel is then be removed supercritically to form porous amorphous hydroxide. This porous hydroxide materials is sintered to 725° C. under the ammonia flow and porous nitride powder is formed. The other way to obtain high surface area nitride, carbonitride, and oxycarbonitride powder is to pyrolyze polymerized templated metal amides aerogel in an inert atmosphere. The electrochemical capacitors are prepared by using sol-gel prepared nitride, carbonitride, and oxycarbonitride powder. Two methods are used to assemble the capacitors.
    Type: Grant
    Filed: February 4, 1999
    Date of Patent: January 2, 2001
    Assignee: Chemat Technology, Inc.
    Inventors: Yuhong Huang, Oiang Wei, Chung-tse Chu, Haixing Zheng