Patents by Inventor Tse-An Lin

Tse-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194926
    Abstract: A containment apparatus for battery tray rack includes a pressing module, a securing module, and a controller. In response to that the containment apparatus is to form the containment on the battery tray rack, the controller controls the pressing module to apply a compressive force, so that the battery tray rack withstands a clamping pressure, and the controller controls the securing module to lock the battery tray rack to maintain the clamping pressure. In response to that the containment apparatus is to release the containment from the battery tray rack, the controller controls the pressing module to apply the compressive force, and the controller controls the securing module to unlock the battery tray rack, and then the controller controls the pressing module to cancel the compressive force.
    Type: Application
    Filed: November 21, 2023
    Publication date: June 13, 2024
    Applicant: CHROMA ATE INC.
    Inventors: Ying-Cheng Chen, Wen-Chuan Chang, Ying-Chi Chen, Chuan-Tse Lin
  • Patent number: 12009345
    Abstract: An embodiment is method including forming a first die package over a carrier substrate, the first die package comprising a first die, forming a first redistribution layer over and coupled to the first die, the first redistribution layer including one or more metal layers disposed in one or more dielectric layers, adhering a second die over the redistribution layer, laminating a first dielectric material over the second die and the first redistribution layer, forming first vias through the first dielectric material to the second die and forming second vias through the first dielectric material to the first redistribution layer, and forming a second redistribution layer over the first dielectric material and over and coupled to the first vias and the second vias.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng
  • Publication number: 20240167163
    Abstract: An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first metal layer. The anti-diffusion layer is an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer is mounted on the substrate and extended on the anti-diffusion layer within each of the through holes. The substrate circuit layer is made of a second metal layer, and a composition of the second metal layer is different from a composition of the first metal layer. The chip is electrically connected to the substrate circuit layer. The anti-diffusion layer is able to better prevent material of the first metal layer from migrating or diffusing to the second metal layer.
    Type: Application
    Filed: December 23, 2022
    Publication date: May 23, 2024
    Inventors: YI LING CHEN, WEI TSE HO, CHIN-SHENG WANG, PU-JU LIN, CHENG-TA KO
  • Patent number: 11972587
    Abstract: An establishing method of semantic distance map for a moving device, includes capturing an image; obtaining a single-point distance measurement result of the image; performing recognition for the image to obtain a recognition result of each obstacle in the image; and determining a semantic distance map corresponding to the image according to the image, the single-point distance measurement result and the recognition result of each obstacle of in the image; wherein each pixel of the semantic distance map includes an obstacle information, which includes a distance between the moving device and an obstacle, a type of the obstacle, and a recognition probability of the obstacle.
    Type: Grant
    Filed: May 22, 2022
    Date of Patent: April 30, 2024
    Assignee: FITIPOWER INTEGRATED TECHNOLOGY INC.
    Inventors: Hsueh-Tse Lin, Wei-Hung Hsu, Shang-Yu Yeh
  • Publication number: 20240125776
    Abstract: Provided herein are encoded microcarriers for analyte detection in multiplex assays. The microcarriers are encoded with an analog code for identification and comprise a capture agent for analyte detection and a substantially transparent magnetic polymer. The analog code is generated by a two-dimensional shape of a substantially non-transparent layer. Also provided are methods of making the encoded microcarriers disclosed herein. Further provided are methods and kits for conducting a multiplex assay using the microcarriers described herein.
    Type: Application
    Filed: November 21, 2023
    Publication date: April 18, 2024
    Applicant: Plexbio Co., Ltd.
    Inventors: Dean TSAO, Chin-Shiou HUANG, Cheng-Tse LIN, Chien-Te WU, FengKan LU
  • Publication number: 20240119693
    Abstract: A method of an optical sensor device includes: providing an optical sensor for receiving reflected light associated with a light emission unit to generate at least one sensed image; using a first exposure setting to make the optical sensor generate a first frame data during a first frame time period of a frame; when performing an exposure adjustment operation, using a second exposure setting to make the optical sensor generate a second frame data during a second time period of the frame neighbor to the first frame time period of the frame; and, generating a normalized digital signal corresponding to the first frame data based on the relation between the first frame data and the second frame data.
    Type: Application
    Filed: September 25, 2022
    Publication date: April 11, 2024
    Applicant: PixArt Imaging Inc.
    Inventor: Ming-Tse Lin
  • Publication number: 20240117917
    Abstract: A lifting device is provided. The lifting device includes a stationary member, a lifting member, positioning bases, reels, and springs. The lifting member is slidably coupled to the stationary member. The lifting member is fixed to a back portion of the display. The positioning bases are disposed on the stationary member and the lifting member. The reels are pivoted on the positioning bases. The springs are wound around the reels and connected to the other of the stationary member and the lifting member relative to the positioning bases. When the display or the lifting member is subjected to an applied force toward a sliding direction, the lifting member slides toward the sliding direction relative to the stationary member. The springs stretched by the lifting member generate an elastic force, so that the lifting member and the display no longer subjected to a force stay at a height position after sliding.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: AmTRAN TECHNOLOGY Co., Ltd.
    Inventors: Hung-Tse Wang, Jun-Hong Lin
  • Patent number: 11955460
    Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20240097216
    Abstract: The present invention discloses a detection device and a probe module thereof, wherein an electrical connection path between a battery detection frame and a battery under test is provided via the probe module. The probe module includes a base, a first polarity plate, a second polarity plate, a first upper connection group, a second upper connection group, a first lower connection member and a second lower connection member. Via the first polarity plate, the first upper connection group is correspondingly coupled to the battery detection frame, and the first lower connection member is correspondingly coupled to the battery under test. Via the second polarity plate, the second upper connection group is correspondingly coupled to the battery detection frame, and the second lower connection member is correspondingly coupled to the battery under test. Thus, it is not necessary to process a cable having been fixed on the battery detection frame when the probe module is replaced.
    Type: Application
    Filed: June 8, 2023
    Publication date: March 21, 2024
    Inventors: CHUAN-TSE LIN, CHEN-CHOU WEN, SHIH-CHIN TAN, WEN-CHUAN CHANG, YING-CHENG CHEN
  • Publication number: 20240085739
    Abstract: A wavelength conversion element including a substrate, a blocking wall structure layer, and a wavelength conversion layer is provided. The blocking wall structure layer is disposed on a surface of the substrate and defines multiple microgrooves. Reflectivity of the blocking wall structure layer is in a range of 1% to 99%. The wavelength conversion layer is disposed in the microgrooves and includes multiple wavelength conversion particles. A height of the blocking wall structure layer along a normal direction of the surface of the substrate is greater than a height of the wavelength conversion layer along the normal direction of the surface of the substrate. A backlight module adopting the wavelength conversion element is also provided.
    Type: Application
    Filed: September 4, 2023
    Publication date: March 14, 2024
    Applicant: Nano Precision Taiwan Limited
    Inventors: Ching-Nan Chuang, Hung-Tse Lin, Ming-Dah Liu, Yen-Ni Lin
  • Publication number: 20240089581
    Abstract: An electronic system including an image sensor, a face detection engine, an eye detection engine and an eye protection engine is provided. The image sensor captures an image. The face detection engine recognizes a user face in the image. The eye detection engine recognizes user eyes in the image. The eye protection engine turns off a display device when the user eyes are recognized in the image but the user face is not recognized in the image.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: HAN-CHANG LIN, GUO-ZHEN WANG, NIEN-TSE CHEN
  • Patent number: 11927780
    Abstract: A dielectric grating apparatus comprises a substrate; a grating layer, disposed above the substrate; a first interference layer, disposed above the substrate; and a second interference layer, adjacent to the first interference layer, wherein a refractive index of a material of the second interference layer is greater than a refractive index of a material of the first interference layer.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 12, 2024
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jian-Hung Lin, Chiang-Hsin Lin, Po-Tse Tai, Tsong-Dong Wang, Bo-Kai Feng
  • Patent number: 11823919
    Abstract: A multi-shield plate includes a plurality of windows and a plurality of vapor shields mounted to the plurality of windows, wherein each window of the plurality of windows is formed in the plate and extends through an entirety of the plate in a thickness direction. The multi-shield plate further includes a plurality of apertures in the plate, wherein each of the plurality of apertures extends through the entirety of the plate in the thickness direction and, an aperture of the plurality of apertures is aligned with a corresponding window of the plurality of windows along radius of the multi-shield plate.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ping-Tse Lin, Wen-Cheng Lien, Chun-Chih Lin, Monica Ho
  • Publication number: 20230360239
    Abstract: An establishing method of semantic distance map for a moving device, includes capturing an image; obtaining a single-point distance measurement result of the image; performing recognition for the image to obtain a recognition result of each obstacle in the image; and determining a semantic distance map corresponding to the image according to the image, the single-point distance measurement result and the recognition result of each obstacle of in the image; wherein each pixel of the semantic distance map includes an obstacle information, which includes a distance between the moving device and an obstacle, a type of the obstacle, and a recognition probability of the obstacle.
    Type: Application
    Filed: May 22, 2022
    Publication date: November 9, 2023
    Applicant: VISUAL SENSING TECHNOLOGY CO., LTD.
    Inventors: Hsueh-Tse Lin, Wei-Hung Hsu, Shang-Yu Yeh
  • Publication number: 20230290719
    Abstract: A semiconductor structure includes an interposer substrate, an electronic device formed in a device region of the interposer substrate, a guard ring formed in the interposer substrate and surrounding the device region, a first redistribution layer on an upper surface of the interposer substrate and covering the device region and the guard ring, and a chip disposed on the first redistribution layer and overlapping the device region.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 14, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hung Chen, Ming-Tse Lin
  • Patent number: 11699646
    Abstract: A semiconductor structure includes an interposer substrate having an upper surface, a lower surface opposite to the upper surface, and a device region. A first redistribution layer is formed on the upper surface of the interposer substrate. A guard ring is formed in the interposer substrate and surrounds the device region. At least a through-silicon via (TSV) is formed in the interposer substrate. An end of the guard ring and an end of the TSV that are near the upper surface of the interposer substrate are flush with each other, and are electrically connected to the first redistribution layer.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: July 11, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Hung Chen, Ming-Tse Lin
  • Publication number: 20230166726
    Abstract: A vehicle driving control apparatus and a control method and a display method for the same are provided. The vehicle driving control apparatus includes a sensor and a processor. The sensor detects current relative position and current relative velocity of an object around a vehicle. The processor calculates a collision probability between the vehicle and the object based on the current relative position and current relative velocity of the object, and determines whether to adjust a driving dynamics of the vehicle based on the collision probability.
    Type: Application
    Filed: December 28, 2021
    Publication date: June 1, 2023
    Applicant: Industrial Technology Research Institute
    Inventors: Kun-Lung Ku, Wen-Han Lu, Chia-Jui Hu, Ching-Wen Chen, Tse-Lin Lee
  • Patent number: 11644726
    Abstract: A display device includes two adjacent pixel electrodes spaced apart from each other by a gap extending in a first direction, at least one signal line extending in the first direction and having at least one protrusion at at least one side thereof, and two adjacent common electrode lines spaced apart from each other. The orthogonal projection of one/the other common electrode line on the substrate is located between the orthogonal projection of the signal line on the substrate and the orthogonal projection of one/the other pixel electrode on the substrate. Each common electrode line has a bend segment bending away from the signal line, wherein the protrusion of the at least one signal line positionally corresponds to the bend segment of each common electrode line, and the length of the protrusion is not larger than the length of the bend segment.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: May 9, 2023
    Assignee: Au Optronics Corporation
    Inventors: Hung-Che Lin, Yi-Chu Wang, Chien-Huang Liao, Yi-Tse Lin, Fu-ming Yu
  • Publication number: 20230136759
    Abstract: A display device includes two adjacent pixel electrodes spaced apart from each other by a gap extending in a first direction, at least one signal line extending in the first direction and having at least one protrusion at at least one side thereof, and two adjacent common electrode lines spaced apart from each other. The orthogonal projection of one/the other common electrode line on the substrate is located between the orthogonal projection of the signal line on the substrate and the orthogonal projection of one/the other pixel electrode on the substrate. Each common electrode line has a bend segment bending away from the signal line, wherein the protrusion of the at least one signal line positionally corresponds to the bend segment of each common electrode line, and the length of the protrusion is not larger than the length of the bend segment.
    Type: Application
    Filed: March 24, 2022
    Publication date: May 4, 2023
    Applicant: Au Optronics Corporation
    Inventors: Hung-Che Lin, Yi-Chu Wang, Chien-Huang Liao, Yi-Tse Lin, Fu-ming Yu
  • Publication number: 20230101900
    Abstract: A structure of semiconductor device is provided, including a first circuit structure, formed on a first substrate. A first test pad is disposed on the first substrate. A second circuit structure is formed on a second substrate. A second test pad is disposed on the second substrate. A first bonding pad of the first circuit structure is bonded to a second bonding pad of the second circuit structure. One of the first test pad and the second test pad is an inner pad while another one of the first test pad and the second test pad is an outer pad, wherein the outer pad surrounds the inner pad.
    Type: Application
    Filed: December 7, 2022
    Publication date: March 30, 2023
    Applicant: United Microelectronics Corp.
    Inventors: Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Ming-Tse Lin, Chien En Hsu