Patents by Inventor Tse-Hsi “Terrence” Lee

Tse-Hsi “Terrence” Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating MEMS devices using plasma etching and device therefor
    Patent number: 10913653
    Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: February 9, 2021
    Assignee: MCUBE INC.
    Inventors: Ben (Wen-Pin) Chuang, M H (Ming-Hong) Kuo, W J (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
  • METHOD OF FABRICATING MEMS DEVICES USING PLASMA ETCHING AND DEVICE THEREFOR
    Publication number: 20160257559
    Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 8, 2016
    Inventors: Ben (Wen-Pin) Chuang, MH (Ming-Hong) Kuo, WJ (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee