Patents by Inventor Tse-Hsin WANG

Tse-Hsin WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230235969
    Abstract: A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit and a working fluid. The heat exchanging unit is independently disposed and divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and a plurality of heat-dissipating fins for cooling the pipe. Two ends of the pipe are connected to from a closed pipe. The pipe runs in the first and the second heat exchanging portions alternately. The heat-dissipating fins are not continuously disposed in the first heat exchanging portion and the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The working fluid flows in the pipe.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 27, 2023
    Inventors: Hsueh-Chi PAN, Tse-Hsin WANG, Chia-Wei CHEN, Ying-Chi CHEN
  • Publication number: 20200208921
    Abstract: A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit, a compressor, a circulation loop, and a working fluid. The heat exchanging unit is divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and multiple heat-dissipating fins for cooling the pipe. The pipe is disposed in the heat exchanging unit. The pipe runs in the first heat exchanging portion and then runs in the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The circulation loop is communicated to the heat exchanging unit and the compressor. The compressor compresses the working fluid to flow in the circulation loop.
    Type: Application
    Filed: December 19, 2019
    Publication date: July 2, 2020
    Inventors: Hsueh-Chi PAN, Tse-Hsin WANG, Chia-Wei CHEN, Ying-Chi CHEN
  • Patent number: 10088249
    Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 2, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wu-Chi Lee, Tse-Hsin Wang, Ying-Chi Chen, Lee-Lung Chen
  • Patent number: 10064309
    Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: August 28, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Lee-Lung Chen, Tse-Hsin Wang, Ying-Chi Chen, Wu-Chi Li
  • Publication number: 20170257976
    Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.
    Type: Application
    Filed: February 10, 2017
    Publication date: September 7, 2017
    Inventors: Lee- Lung CHEN, Tse-Hsin WANG, Ying-Chi CHEN, Wu-Chi LI
  • Publication number: 20170184353
    Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.
    Type: Application
    Filed: May 31, 2016
    Publication date: June 29, 2017
    Inventors: Wu-Chi LEE, Tse-Hsin WANG, Ying-Chi CHEN, Lee-Lung CHEN