Abstract: A semiconductor device with contact check circuitry is provided. The semiconductor device includes a plurality of pads, an internal circuit, and a contact check circuit. The plurality of pads includes a first pad and a second pad. The internal circuit is coupled to the plurality of pads. The contact check circuit, at least coupled to the first pad and the second pad, is used for checking, when the semiconductor device is under test, contact connections to the first pad and the second pad to generate a check result signal according to comparison of a first test signal and a second test signal received from the first pad and the second pad with at least one reference signal.

Abstract: A semiconductor device with contact check circuitry is provided. The semiconductor device includes a plurality of pads, an internal circuit, and a contact check circuit. The plurality of pads includes a first pad and a second pad. The internal circuit is coupled to the plurality of pads. The contact check circuit, at least coupled to the first pad and the second pad, is used for checking, when the semiconductor device is under test, contact connections to the first pad and the second pad to generate a check result signal according to comparison of a first test signal and a second test signal received from the first pad and the second pad with at least one reference signal.

Abstract: A memory test circuit comprising: a first latch circuit for receiving a first input address and an error indication signal to generate a first address; a first E-fuse group for receiving the first address to generate an output address; a second latch circuit for receiving the error indication signal; a second E-fuse group for generating an error indication signal according to an output of the second latch circuit which is generated according to the fault indication signal; and a comparison circuit for activating the second latch circuit according to a relation between the first address and a second input address and a state of the first latch circuit or the first E-fuse group.

Abstract: A memory test circuit comprising: a first latch circuit for receiving a first input address and an error indication signal to generate a first address; a first E-fuse group for receiving the first address to generate an output address; a second latch circuit for receiving the error indication signal; a second E-fuse group for generating an error indication signal according to an output of the second latch circuit which is generated according to the fault indication signal; and a comparison circuit for activating the second latch circuit according to a relation between the first address and a second input address and a state of the first latch circuit or the first E-fuse group.

Abstract: An E-fuse circuit comprising: an E-fuse group, comprising a plurality of E-fuse sections, wherein each one of the E-fuse sections comprises a plurality of E-fuses; a multi-mode latch circuit, configured to receive an input signal to generate a first output signal in a burn in mode, and configured to receive an address to be compared to generate a second output signal in a normal mode; a first logic circuit group, configured to receive a first part of bits of the first output signal to generate a control signal in the burn in mode; and a second logic circuit group, configured to receive the control signal and a second part of bits of the first output signal to generate a selection signal in the burn in mode, to select which one of the E-fuse sections is activated.

Abstract: The present application proposes a memory chip includes a plurality of memory banks, a plurality of address pins, and a pseudo-address determining circuit. The plurality of address pins is arranged for receiving a plurality of address signals corresponding to the plurality of memory banks, respectively. The pseudo-address determining circuit has a plurality of input terminals coupled to the plurality of address pins, respectively, and a plurality of output terminals coupled to the plurality of memory banks. The pseudo-address determining circuit generates a pseudo-address table for the plurality of memory banks when the memory chip is powered-up. The pseudo-address table has a plurality of pseudo-addresses corresponding to the plurality of memory banks, respectively. The present application also provides a memory module that incorporates the memory chip and a method for pseudo-accessing memory banks of the memory chip.

Abstract: The present application proposes a memory chip includes a plurality of memory banks, a plurality of address pins, and a pseudo-address determining circuit. The plurality of address pins is arranged for receiving a plurality of address signals corresponding to the plurality of memory banks, respectively. The pseudo-address determining circuit has a plurality of input terminals coupled to the plurality of address pins, respectively, and a plurality of output terminals coupled to the plurality of memory banks. The pseudo-address determining circuit generates a pseudo-address table for the plurality of memory banks when the memory chip is powered-up. The pseudo-address table has a plurality of pseudo-addresses corresponding to the plurality of memory banks, respectively. The present application also provides a memory module that incorporates the memory chip and a method for pseudo-accessing memory banks of the memory chip.

Abstract: An E-fuse burning circuit comprising: a burning directing circuit, configured to receive first input data comprising first input address and burning directing data, to generate a burning directing signal according to the burning directing data; a ring address latch, configured to latch the first input address responding to a first clock signal, and configured to output second input address responding to the first clock signal; and a control signal generating circuit, configured to generate at least one stop signal to determine whether the data in the ring address latch is shifted or not. The ring address latch applies a first number of the stages when the burning directing signal indicates a row of the E-fuse circuit is to be burned and applies a second number of the stages when the burning directing signal indicates a column of the E-fuse circuit is to be burned.

Abstract: An E-fuse circuit comprising: a ring address latch, configured to receive a first input address arranged in serial i bits responding to a first clock signal, and to output a second input address arranged in serial j bits responding to a second clock signal; a control signal generating circuit, configured to receive the second input address, and to decode the second input address to generate first control signals with m bits and second control signals with n bits, wherein the first control signals and the second control signals are transmitted in parallel, and m, n are factors of j; and an E-fuse group, comprising j fuses. If any one of the first control signals has a first logic value and any one of the second control signals has the logic value, a corresponding fuse the E-fuse group is burned.

Abstract: A memory auto repairing circuit including: a decoding circuit, a latch enable circuit and a first latch circuit, wherein the decoding circuit is arranged to compare a first input address with a plurality of fail addresses to generate a control signal; the latch enable circuit is arranged to selectively generate a first enable signal at least according to the control signal; and the first latch circuit is arranged to receive the first input address, and store the first input address when the first enable signal is received by the first latch circuit; wherein when the control signal indicates that the first input address is identical to one of the plurality of fail addresses, the enable signal is prevented from being transmitted from the latch enable circuit to the first latch circuit.

Abstract: a memory auto repairing circuit including: a decoding circuit, a latch enable circuit and a first latch circuit, wherein the decoding circuit is arranged to compare a first input address with a plurality of fail addresses to generate a control signal; the latch enable circuit is arranged to selectively generate a first enable signal at least according to the control signal; and the first latch circuit is arranged to receive the first input address, and store the first input address when the first enable signal is received by the first latch circuit; wherein when the control signal indicates that the first input address is identical to one of the plurality of fail addresses, the enable signal is prevented from being transmitted from the latch enable circuit to the first latch circuit.

Abstract: A voltage regulator in a semiconductor memory has: a comparing unit including first and second bias current sources, for comparing an output voltage with first and second reference voltages under control of a first signal, the second bias current source being ON under control of a second signal; and a driver active element, coupled to the comparing unit, for outputting the output voltage. Before sensing operations, the output voltage is reset to the second reference voltage. During the sensing operations, the output voltage is maintained at the first reference voltage and the second signal is asserted for turning ON the second bias current source for raising speed of the comparing unit. After the sensing operations, the output voltage is reset to the second reference voltage.

Abstract: A voltage regulator in a semiconductor memory has: a comparing unit including first and second bias current sources, for comparing an output voltage with first and second reference voltages under control of a first signal, the second bias current source being ON under control of a second signal; and a driver active element, coupled to the comparing unit, for outputting the output voltage. Before sensing operations, the output voltage is reset to the second reference voltage. During the sensing operations, the output voltage is maintained at the first reference voltage and the second signal is asserted for turning ON the second bias current source for raising speed of the comparing unit. After the sensing operations, the output voltage is reset to the second reference voltage.

Abstract: A voltage regulator as a stable power supply to internal circuits in a semiconductor memory device is provided. This regulator includes a comparing unit, a first driver transistor, a feedback unit, an auxiliary control unit, a first switch, a second switch, and a second driver transistor. The comparing unit compares a reference voltage with a feedback signal to control the first driver transistor and maintain the internal power supply at a stable level. The second driver transistor, controlled by the first and second switches responsive to a trigger signal corresponding abrupt current consumptions and the auxiliary control unit responsive to the comparing result, supplies sufficient and appropriate current to the internal circuits and prevents the internal power supply from excessive overshoot and drop-out.

Abstract: A voltage regulator as a stable power supply to internal circuits in a semiconductor memory device is provided. This regulator includes a comparing unit, a first driver transistor, a feedback unit, an auxiliary control unit, a first switch, a second switch, and a second driver transistor. The comparing unit compares a reference voltage with a feedback signal to control the first driver transistor and maintain the internal power supply at a stable level. The second driver transistor, controlled by the first and second switches responsive to a trigger signal corresponding abrupt current consumptions and the auxiliary control unit responsive to the comparing result, supplies sufficient and appropriate current to the internal circuits and prevents the internal power supply from excessive overshoot and drop-out.