Patents by Inventor Tse-Min Wen

Tse-Min Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100323101
    Abstract: A method for preparing a surface modification coating of metal bipolar plates is disclosed, which comprises the following steps: providing a metal substrate; pre-treating the metal substrate by substrate processing, depositing a Ni-based alloy layer on the metal substrate, or the combination thereof to form an activated layer on the surface of the metal substrate; packing the metal substrate in a powder mixture comprising permeated master metal, an activator, and filler powders; heat-treating the metal substrate in the powder mixture to allow the permeated master metal to diffuse into the activated layer and then to form a surface modification coating. The permeation rate of the permeated master metal can be increased due to high defect concentration of the activated layer. Hence, a corrosion-resistant surface modification coating is prepared at a low temperature, and it can decrease the interface contact resistance between the metal bipolar plates and gas diffusion layers.
    Type: Application
    Filed: September 14, 2009
    Publication date: December 23, 2010
    Applicant: National Defense University
    Inventors: Ching-Yuan Bai, Tse-Min Wen, Ming-Der Ger, Shuo-Jen Lee, Po-Hsiu Chien