Patents by Inventor TSE-WEI LIAO

TSE-WEI LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149797
    Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna comprises a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator resonate at a low frequency band and a first high frequency band, and a part of the first radiator and the third radiator resonate at a second high frequency band. The second antenna includes a fourth radiator, the second radiator, and a connecting section. The connecting section is connected between the fourth radiator and the second radiator. A part of the fourth radiator, the connecting section, and the second radiator resonate at the low frequency band and the second high frequency band, and the fourth radiator, the connecting section, and a part of the second radiator resonate at the first high frequency band.
    Type: Application
    Filed: July 11, 2024
    Publication date: May 8, 2025
    Applicant: PEGATRON CORPORATION
    Inventors: Chao-Hsu Wu, Chien-Yi Wu, Hao-Hsiang Yang, Tse-Hsuan Wang, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Chia-Hung Chen
  • Publication number: 20250096476
    Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna includes a first feeding end, a first segment, a second segment, a third segment, and a fourth segment. A first area of the first antenna and a second area including a part of the first antenna and a part of the ground radiator resonate at a first frequency band. A third area of the first antenna and the second area resonate at a second frequency band. An area including a part of the second antenna, the third segment, the first segment, and the second segment resonates at the first frequency band. An area of the second antenna and an area including the part of the second antenna, a part of the third segment, and another part of the ground radiator resonate at the second frequency band.
    Type: Application
    Filed: May 2, 2024
    Publication date: March 20, 2025
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Shao-Chi Wang, Hau Yuen Tan, Hung-Te Liao, Chao-Hsu Wu, Chih-Hung Cho, Tse-Hsuan Wang, I-Shu Lee, Jr-Wei Hsu
  • Publication number: 20250087888
    Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.
    Type: Application
    Filed: May 30, 2024
    Publication date: March 13, 2025
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Tse-Hsuan Wang, Chih-Fu Chang, Hsin-Feng Hsieh, Wu-Hua Chen, Chih-Wei Liao, Chao-Hsu Wu
  • Patent number: 12236903
    Abstract: A display device and a backlight control method of the display device are provided. When a duration of an image occlusion period is shorter than a preset duration, a backlight driving circuit is controlled to respectively provide a first pulse current and a second pulse current in a first light emitting period and a second light emitting period in each frame period, so as to drive a backlight unit to provide a first backlight and a second backlight. Here, the first pulse current is greater than the second pulse current.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: February 25, 2025
    Assignee: Qisda Corporation
    Inventors: Chun-Chang Wu, Yi-Zong Jhan, Jen-Hao Liao, Tse-Wei Fan, Wei-Yu Chen, Fu-Tsu Yen, Feng-Lin Chen
  • Publication number: 20250015034
    Abstract: A semiconductor structure includes a first die; a molding surrounding the first die; a redistribution layer (RDL) disposed under the first die and the molding, and including a plurality of first conductive pads and a dielectric layer surrounding the plurality of first conductive pads; a second die disposed under the RDL, and including a plurality of first die pads over the second die; and a plurality of first conductive bumps disposed between the RDL and the second die, wherein each of the plurality of first conductive bumps is electrically coupled with corresponding one of the plurality of first die pads and corresponding one of the plurality of first conductive pads, the plurality of first die pads are respectively arranged at corners of the second die, and the plurality of first conductive bumps are electrically connected in series.
    Type: Application
    Filed: July 5, 2023
    Publication date: January 9, 2025
    Inventors: TSE-WEI LIAO, YANG-CHE CHEN, CHI-HUI LAI, WEI-YU CHOU, HSIANG-TAI LU