Patents by Inventor Tse Wei YU

Tse Wei YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639454
    Abstract: An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: May 2, 2023
    Assignee: CJ TECHNOLOGY CO., LTD.
    Inventors: Tse Wei Yu, Hao-Han Fan
  • Publication number: 20210108115
    Abstract: An adhesive for joining metals and resins is disclosed. The adhesive comprises 0.0001˜3 wt. % of amino silane, 0.0001˜1 wt. % of a crosslinker and 0.0001˜3 wt. % of an organometallic compound. In particular, the adhesive forms an adhesive layer that has a metal atomic ratio less than 50%.
    Type: Application
    Filed: October 7, 2020
    Publication date: April 15, 2021
    Inventors: Tse Wei Yu, Hao-Han Fan
  • Patent number: 10170296
    Abstract: The present invention relates to a novel composition that may be used to control the etching rate of TIN with respect to W, and remove any residues from the surface, e.g. organic or inorganic residues that could contain fluorine (F), which composition comprises a) an aliphatic or aromatic sulfonic acid; b) one or more inhibitor(s); c) an aprotic solvent; d) a glycol ether; and e) water. The present invention also relates to a kit comprising said composition in combination with an oxidant and optionally a stabilizer of the oxidant, and the use thereof.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: January 1, 2019
    Assignee: BASF SE
    Inventors: Jerry Jhih-Jheng Ke, Tse Wei Yu, Yi-Ping Cheng
  • Patent number: 10141181
    Abstract: The present invention relates to a novel composition that may be used to control the etching rate of TIN with respect to W, and remove any residues from the surface, e.g. organic or inorganic residues that could contain fluorine (F), which composition comprises a) an aliphatic or aromatic sulfonic acid; b) one or more inhibitor(s); c) an aprotic solvent; d) a glycol ether; and e) water. The present invention also relates to a kit comprising said composition in combination with an oxidant and optionally a stabilizer of the oxidant, and the use thereof.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: November 27, 2018
    Assignee: BASF SE
    Inventors: Jerry Jhih-Jheng Ke, Tse Wei Yu, Yi-Ping Cheng
  • Publication number: 20170076939
    Abstract: The present invention relates to a novel composition that may be used to control the etching rate of TIN with respect to W, and remove any residues from the surface, e.g. organic or inorganic residues that could contain fluorine (F), which composition comprises a) an aliphatic or aromatic sulfonic acid; b) one or more inhibitor(s); c) an aprotic solvent; d) a glycol ether; and e) water. The present invention also relates to a kit comprising said composition in combination with an oxidant and optionally a stabilizer of the oxidant, and the use thereof.
    Type: Application
    Filed: May 12, 2015
    Publication date: March 16, 2017
    Applicant: BASF SE
    Inventors: Jerry Jhih-Jheng KE, Tse Wei YU, Yi-Ping CHENG