Patents by Inventor Tseng-Bao Sun

Tseng-Bao Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150077997
    Abstract: The present disclosure provides an LED lighting device comprising a heat dissipation body, a driver module and a lighting module. The heat dissipation body includes a base, a heat dissipation wall, heat dissipation fins and a top face. The heat dissipation wall defines a heat dissipation channel therein and is formed with first through holes. The heat dissipation fins are formed on and encircle the heat dissipation wall. The top face is formed with a first opening The driver module is disposed inside the heat dissipation body. The lighting module includes a tube body and LED light sources. The tube body has two end openings in fluid communication with each other and one of the end openings is connected to the first opening The LED light sources are arranged on the tube body and are electrically connected to the driver module.
    Type: Application
    Filed: September 13, 2014
    Publication date: March 19, 2015
    Inventor: TSENG-BAO SUN
  • Publication number: 20070108455
    Abstract: A three wavelength light emitting diode (LED) structure utilizes a blue light LED chip and a green light LED chip as light sources, and a red fluorescent layer is used as a light transition layer. By adjusting the number of the blue light LED chip and the green light LED chip and the dosage of the chemical substances in the red fluorescent layer, the present invention can produce a white light LED which is adjustable in color temperature, a neutral color LED whose color is changeable, or can produce a LED whose light color changes with time.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 17, 2007
    Inventors: Tseng-Bao Sun, Ko-Shin Lee
  • Publication number: 20060255359
    Abstract: An LED light source model has a substrate, at least one bare LED chip, a transparent layer and an optical light collecting element. The substrate has a top face, a bottom face and at least one chip cup defined on the top face. The at least one LED chip is mounted in the at least one chip cup. The transparent layer is formed on the top face to seal the at least one chip cup. The optical light collecting element is mounted on the top face to collect the light from each chip cup to increase the light intensity. A plurality of fins or recesses are formed or defined on the bottom face to increase a heat dissipation area. When each bare LED chip is in operation mode, heat from the bare LED chip will be conducted to the bottom face and then dissipate to the ambient air quickly.
    Type: Application
    Filed: October 17, 2005
    Publication date: November 16, 2006
    Applicant: Quasar Optoelectronics, Inc.
    Inventors: Tseng-Bao Sun, Ko-Hsin Lee, Yong-Yuan Xu