Abstract: A bone conduction receiver includes a housing, a vibrating plate, a bracket, a magnetic loop assembly, a coil, and a protective cover. The vibrating plate is disposed inside the housing and keeps a distance from an inner bottom of the housing. The protective cover is located on one side of the vibrating plate, facing away from the inner bottom of the housing, and covers the opening of the accommodation room. The bracket is located on the side of the vibrating plate, facing away from the inner bottom of the housing. The magnetic loop assembly is secured in the bracket. One end of the coil is fixed to an inner side of the protective cover, and another end of the coil extends into the bracket and surrounds the magnetic loop assembly.

Abstract: A heat press docking station base (52) comprises a nest portion (75) and one or more legs (58). The nest portion (52) includes a body shell (60, 62) and a perforated floor (54). The body shell (60, 62) includes a lower surface (63). The perforated floor (54) is connected to the body shell (60, 62). The one or more legs (58) extend from a lower surface (63) of the body shell (60, 62).

Abstract: A sports shoe is provided. The sports shoe includes a shoe vamp and a shoe sole connected to the shoe vamp. The shoe vamp includes a textile component, wherein the textile component includes thermoplastic polyester fibers. The shoe sole includes a shoe outsole and a shoe midsole foam disposed between the shoe outsole and the shoe vamp, wherein the shoe outsole includes a vulcanizate and the shoe midsole foam includes a first thermoplastic elastomer. The vulcanizate includes rubber particles, a second thermoplastic elastomer, and an interface-compatible resin, wherein the content of the rubber particles is greater than the content of the second thermoplastic elastomer. The rubber particles are dispersed in the second thermoplastic elastomer in the form of spherical particles with particle sizes of about 0.5-10 um.

Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.

Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.

Abstract: A heat press docking station base (52) comprises a nest portion (75) and one or more legs (58). The nest portion (52) includes a body shell (60, 62) and a perforated floor (54). The body shell (60, 62) includes a lower surface (63). The perforated floor (54) is connected to the body shell (60, 62). The one or more legs (58) extend from a lower surface (63) of the body shell (60, 62).

Abstract: A heat press docking station base (52) comprises a nest portion (75) and one or more legs (58). The nest portion (52) includes a body shell (60, 62) and a perforated floor (54). The body shell (60, 62) includes a lower surface (63). The perforated floor (54) is connected to the body shell (60, 62). The one or more legs (58) extend from a lower surface (63) of the body shell (60, 62).

Abstract: The present application relates to a driving circuit for display panel, which drives a plurality of pixel structures of a display panel. Each of pixel structures comprises a light emitting element, which is coupled between a first voltage and a second voltage. The driving circuit comprises a power supply circuit, which is coupled to the pixel structures, provides the first voltage and the second voltage, and adjusts the first voltage or/and the second voltage for adjusting a voltage difference between the first voltage and the second voltage. That is, a current flowing through the light emitting elements of the pixel structures may be adjusted for reducing the flicker in the display panel.

Abstract: A semiconductor structure includes a conductive structure, a dielectric layer, and a plurality of conductive features. The dielectric layer is present on the conductive structure. The dielectric layer has a plurality of through holes therein, and at least one of the through holes exposes the conductive structure. The conductive features are respectively present in the through holes. At least one of the conductive features has a bottom surface and at least one sidewall. The bottom surface and the sidewall of the conductive feature intersect to form an interior angle. The interior angles of adjacent two of the conductive features have a difference less than or substantially equal to about 3 degrees.

Abstract: A semiconductor structure includes a conductive structure, a dielectric layer, and a plurality of conductive features. The dielectric layer is present on the conductive structure. The dielectric layer has a plurality of through holes therein, and at least one of the through holes exposes the conductive structure. The conductive features are respectively present in the through holes. At least one of the conductive features has a bottom surface and at least one sidewall. The bottom surface and the sidewall of the conductive feature intersect to form an interior angle. The interior angles of adjacent two of the conductive features have a difference less than or substantially equal to about 3 degrees.

Abstract: A method of manufacturing a semiconductor structure including a conductive structure, a dielectric layer, and a plurality of conductive features is disclosed. The dielectric layer is formed on the conductive structure. A plurality of through holes is formed in the dielectric layer using a metal hard mask, and at least one of the through holes exposes the conductive structure. The conductive features are formed in the through holes. At least one of the conductive features has a bottom surface and at least one sidewall. The bottom surface and the sidewall of the conductive feature intersect to form an interior angle. The interior angles of adjacent two of the conductive features have a difference less than or substantially equal to about 3 degrees.