Patents by Inventor Tseng-Chi Kao

Tseng-Chi Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149185
    Abstract: There is provided a building block assembly including a block body formed of EVA; and an adhesive layer adhered to the block body and formed of hydrophobic material having a higher viscosity. The adhesive layer comprises 20 wt %-50 wt % of rubber mixture and 50 wt %-80 wt % of high polymer resin mixed together. The rubber mixture comprises rubber, softening agent and filler. The high polymer resin uses PIB having a heavy molecular weight. There is further provided a building block assembly including a block body formed of soft material; and an adhesive layer adhered to the block body and formed of hydrophobic material having a higher viscosity. The adhesive layer comprises 20 wt %-50 wt % of rubber mixture and 50 wt %-80 wt % of high polymer resin mixed together. The rubber mixture comprises rubber, softening agent and filler. The high polymer resin uses PIB having a heavy molecular weight.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventor: TSENG-CHI KAO
  • Publication number: 20100144942
    Abstract: The present invention relates to water-based and water-free, lightweight modeling compositions comprising a filler made of EVA foam particles and a water-based or water-free matrix. Advantageously, the modeling composition has little to no shrinkage over time and it has an increased product life.
    Type: Application
    Filed: September 14, 2009
    Publication date: June 10, 2010
    Inventor: Tseng-Chi Kao