Patents by Inventor Tseng-Hsuan Huang

Tseng-Hsuan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple nozzle slurry dispense scheme
    Patent number: 11318579
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: May 3, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple Nozzle Slurry Dispense Scheme
    Publication number: 20190321941
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple nozzle slurry dispense scheme
    Patent number: 10335920
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Multiple Nozzle Slurry Dispense Scheme
    Publication number: 20150224626
    Abstract: An apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Inventors: Chih-Hsuan Hsieh, Tseng-Hsuan Huang, Chen-Hsiang Liao
  • Slotted retaining ring for polishing head and method of using
    Patent number: 6267643
    Abstract: The present invention discloses a slotted retaining ring for use in a chemical mechanical polishing head which can be fabricated by providing a plurality of slot recesses in a bottom surface of the retaining ring. Each of the plurality of slot recesses may be formed in a tapered shape with a base portion adjacent to the outer periphery of the ring and a tip portion of a smaller width than the base portion adjacent to the inner periphery of the retaining ring. The tip portion of the tapered shape is normally spaced apart from the inner periphery such that excessive polishing of the wafer edge can be avoided. The present invention further discloses a method for chemical mechanical polishing a semiconductor wafer by using the slotted retaining ring for holding a polishing head therein.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: July 31, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd
    Inventors: Kuo-Hsiu Teng, Tseng-Hsuan Huang