Patents by Inventor Tseng-Hua OU

Tseng-Hua OU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF CUTTING CONDUCTIVE PATTERNS
    Publication number: 20220382160
    Abstract: A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Inventors: Chin-Hsiung HSU, Huang-Yu CHEN, Tseng-Hua OU, Wen-Hao CHEN