Patents by Inventor Tseng-Jung Chen

Tseng-Jung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090044901
    Abstract: A kind of heat conducting glue comprises heat conducting resin, and release films on two sides of the heat conducting resin; the heat conducting glue is made by means of applying conducting resin to a first release film, baking the heat conducting resin to a certain degree, heating and pressing the heat conducting resin so as stick the heat conducting resin on a second release film, and making the heat conducting glue become a roll; two metallic plate materials are joined together by means of detaching the first release film from the heat conducting resin, sticking the heat conducting resin on one of the metallic plate materials, detaching the second release film, and pressing the other metallic plate material and the heat conducting resin against each other to join them together.
    Type: Application
    Filed: August 17, 2007
    Publication date: February 19, 2009
    Inventor: Tseng-Jung Chen