Patents by Inventor Tseng Jyi Peng

Tseng Jyi Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6970356
    Abstract: A heat sink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly consists of a thermal conducting substrate base with a top and bottom side. Radiating fins are attached to the bottom side of the base. The fins are cooled by external air. The component on the circuit board is connected to the top surface of the heat sink base by means of thermal conducting spacers which create a gap between the bottom surface of the circuit board and the top surface of the heat sink base. A first hole is placed in the heat sink base and driving means are attached to the said base at the area of the first hole. A rotating fan is operatively attached to the said driving means in such a manner that when the fan rotates air is forced between the gap created between the circuit board and the heat sink base. A second hole is installed in the heat sink base. The air flowing from the fan is exhausted through the said second hole.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: November 29, 2005
    Inventor: Tseng Jyi Peng
  • Publication number: 20040070939
    Abstract: A heat sink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly consists of a thermal conducting substrate base with a top and bottom side. Radiating fins are attached to the bottom side of the base. The fins are cooled by external air. The component on the circuit board is connected to the top surface of the heat sink base by means of thermal conducting spacers which create a gap between the bottom surface of the circuit board and the top surface of the heat sink base. A first hole is placed in the heat sink base and driving means are attached to the said base at the area of the first hole. A rotating fan is operatively attached to the said driving means in such a manner that when the fan rotates air is forced between the gap created between the circuit board and the heat sink base. A second hole is installed in the heat sink base. The air flowing from the fan is exhausted through the said second hole.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 15, 2004
    Inventor: Tseng Jyi Peng
  • Patent number: D598001
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: August 11, 2009
    Inventor: Tseng Jyi Peng
  • Patent number: D605624
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: December 8, 2009
    Inventor: Tseng Jyi Peng
  • Patent number: D648322
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: November 8, 2011
    Inventor: Tseng Jyi Peng
  • Patent number: D694721
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: December 3, 2013
    Inventor: Tseng Jyi Peng