Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A copolyester is formed by reacting 100 parts by weight of a polyester elastomer and 0.01 to 0.29 parts by weight of a compound having multi-functional groups. The polyester elastomer is formed by reacting polyethylene terephthalate, diol, and poly(alkylene ether)glycol. The polyethylene terephthalate and the diol have a weight ratio of 1:0.6 to 1:3, and the polyethylene terephthalate and the poly(alkylene ether) glycol have a weight ratio of 1:0.05 to 1:3.

Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.

Abstract: A copolyester is formed by copolymerizing a depolymerized polyester and succinic acid. The depolymerized polyester includes depolymerized polyethylene terephthalate (PET), and the depolymerized PET is formed by depolymerizing PET with ethylene glycol. The repeating unit of PET and the succinic acid have a molar ratio of 40:60 to 50:50. The repeating unit of PET and the ethylene glycol have a molar ratio of 100:100 to 100:500. The copolyester has a storage modulus of 1*104 Pa to 1*106 Pa at 80° C. The copolyester can be used in a hot melt adhesive.

Abstract: Disclosed is an optical emission assembly including a body, an adapter, two light-emitting assemblies, a multiplexer and a converging lens. The body is provided with a first positioning groove, a second positioning groove, an accommodation groove, and a through hole. The accommodation groove communicates with the first and second positioning grooves and the through hole. A groove bottom of the first positioning groove communicates with a groove bottom of the second positioning groove. The adapter is connected to the body and disposed corresponding to the through hole. When the two light-emitting assemblies are installed in the first and second positioning grooves, each light-emitting chip of each light-emitting assembly emits beams towards the accommodation groove to make the multiplexer disposed at the bottom of the accommodation groove combine the beams into one beam. The converging lens is disposed in the through hole to converge the one beam on the adapter.

Abstract: Disclosed is an optical emission assembly including a heat dissipation base, an adapter, a light-emitting assembly, a multiplexer, a cooling chip, a converging lens, a housing, and a heat-conducting glue. The heat dissipation base includes a first heat dissipation plate and a second heat dissipation plate forming a T-shaped or an L-shaped structure. The light-emitting assembly and the multiplexer are disposed on the second heat dissipation plate. The multiplexer combines light beams emitted by light-emitting chips of the light-emitting assembly into one light beam, and then the one light beam enters the adapter through the converging lens. The cooling chip is disposed on the first heat dissipation plate. The heat dissipation base and the cooling chip are disposed in the housing, and the cooling chip corresponds to a through hole of the housing. The heat-conducting glue is filled in the through hole and between the cooling chip and the housing.

Abstract: A sports shoe is provided. The sports shoe includes a shoe vamp and a shoe sole connected to the shoe vamp. The shoe vamp includes a textile component, wherein the textile component includes thermoplastic polyester fibers. The shoe sole includes a shoe outsole and a shoe midsole foam disposed between the shoe outsole and the shoe vamp, wherein the shoe outsole includes a vulcanizate and the shoe midsole foam includes a first thermoplastic elastomer. The vulcanizate includes rubber particles, a second thermoplastic elastomer, and an interface-compatible resin, wherein the content of the rubber particles is greater than the content of the second thermoplastic elastomer. The rubber particles are dispersed in the second thermoplastic elastomer in the form of spherical particles with particle sizes of about 0.5-10 um.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A polymer includes a repeating unit M and a repeating unit D, the repeating unit M is —COC6H6CONHCH2CH2O—, the repeating unit D is —COC6H6COOCH2CH2O—, and a molar ratio of the repeating unit M to the repeating unit D is 1:6 to 1:999.

Abstract: A molding structure comprising a first mold body, a second mold body suited for combining with the first mold body, a molding core, a first heating element, and a second heating element is provided. A mold cavity is formed between the first mold body and the second mold body when the first mold body and the second mold body are joined together. The molding core is disposed in the mold cavity, wherein the molding core comprises a body, an inner surface, and an outer surface. The first heating member is disposed through the body to heat the molding core. The second heating element is movably disposed on the outer surface of the molding core to preheat the molding core.

Abstract: An adhesive composition is provided. The adhesive composition includes a solvent and a polyamic acid. The polyamic acid is represented by the following Formula I: in which A is pyrenyl, anthryl, benzo[a]pyrenyl, benzo[e]pyrenyl, naphtho[2,3-a]pyrenyl, dibenzo[a,e]pyrenyl, dibenzo[a,h]pyrenyl or naphthyl; n is 0 to 10; X is greater than 0 and less than 1.

Abstract: A beam-splitting integrated optical element including a shell, at least one first lens, and at least one second lens is provided. The shell includes a first lens surface, a second lens surface, at least one first reflective surface, and at least one second reflective surface. A bottom edge of each first reflective surface and a bottom edge of each second reflective surface are not connected to each other. The at least one first lens is disposed on the first lens surface. The at least one second lens is disposed on the second lens surface, and each second lens has a second optical axis. Each second reflective surface is located at at least one side of the corresponding second optical axis and located on a transmission path of only a portion of a first beam. An optical transmitter module incorporating said beam-splitting optical element is also provided.

Abstract: A solar cell module and a method of fabricating the same are provided. The method includes providing a solution having a luminescent dye, mixing the solution with a first waveguide material to obtain a first mixture, and placing the first mixture and a second mixture having nano-powder and a second waveguide material into a mold to form a waveguide body having a first layer body and a second layer body stacked on the first layer body. The waveguide body has a top surface, a bottom surface opposing to the top surface, and a lateral surface connecting the top surface with the bottom surface. At least one solar cell is disposed in the mold and embedded in the waveguide body, to enlarge a light reception area and light collection.

Abstract: A spectacle structure includes an inner frame unit having two connected horizontal U-shaped frame members respectively formed from an upper, a laterally outer and a lower frame section, the upper frame sections being connected to each other, each of the outer frame sections being provided with two horizontal grooves and a post or a recess or a through hole located between the two grooves, and each of the lower frame sections having a forward and inward extended support section; a lens unit having two connected lenses, each of which being provided with two horizontal ribs and a recess or a through hole or a post corresponding to the outer frame section, allowing the inner frame unit to be firmly assembled to and conveniently disassembled from a rear side of the lens unit; and a wear unit being pivotally connected to two opposite ends of the lens unit.

Abstract: A spectacle structure includes an inner frame unit having two connected horizontal U-shaped frame members respectively formed from an upper, a laterally outer and a lower frame section, the upper frame sections being connected to each other, each of the outer frame sections being provided with two horizontal grooves and a post or a recess or a through hole located between the two grooves, and each of the lower frame sections having a forward and inward extended support section; a lens unit having two connected lenses, each of which being provided with two horizontal ribs and a recess or a through hole or a post corresponding to the outer frame section, allowing the inner frame unit to be firmly assembled to and conveniently disassembled from a rear side of the lens unit; and a wear unit being pivotally connected to two opposite ends of the lens unit.

Abstract: A touch control button apparatus including a touch control light emitting surface, a touch sensing conductor, a touch sensing device and a light emitting device, which is under the touch control light emitting surface and surrounded by the touch sensing conductor. The touch sensing device detects the capacitance value variation of the touch sensing conductor when the touch control light emitting surface is touched by the object, to determine how the light emitting device is lightened.