Patents by Inventor Tseng Shen TSENG

Tseng Shen TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12178407
    Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: December 31, 2024
    Assignee: MEDIMAGING INTEGRATED SOLUTION, INC.
    Inventors: Shangyi Wu, Jiunwei Chen, Jia-De Zhou, Tseng Shen Tseng
  • Publication number: 20230108867
    Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 6, 2023
    Inventors: Shangyi WU, Jiunwei CHEN, Jia-De ZHOU, Tseng Shen TSENG