Abstract: A window-type semiconductor package is disclosed to avoid peeling at the moldflow entrance, primarily comprising a substrate, a chip with the active surface attached to the substrate, a die-attaching layer bonding the active surface of the chip to a substrate core of the substrate, a plurality of bonding wires, and an encapsulant. The substrate core has a slot. One end of the slot outside the chip is formed as a moldflow entrance with two or more moldflow blocking lumps protrusively disposed on the substrate core and located at the intersections between one edge of the chip and the two opposing sides of the slot adjacent to the moldflow entrance. Accordingly, the moldflow pressures exerting at the die-attaching layer are blocked to avoid the peeling of the die-attaching layer at the moldflow entrance and to keep a constant die-attaching gap.

Abstract: An LGA (Land Grid Array) semiconductor package mainly comprises a substrate, a chip, a soldering layer and a foot stand. The chip is disposed on a top surface of the substrate and is electrically connected to a plurality of metal pads formed on a bottom surface of the substrate. The soldering layer is disposed on the metal pads with a first thickness slightly protruded from the bottom surface of the substrate. Additionally, the foot stand is disposed under the substrate with a second thickness protruded from the bottom surface of the substrate, wherein the second thickness is greater than the first thickness. Therefore, the soldering layer of the LGA semiconductor package is free from scratches and damages during shipping and handling processes. Moreover, the LGA semiconductor package can be surface-mounted to a printed circuit board with pre-applied solder or pre-mounted solder balls to increase the implementations of LGA semiconductor packages.

Abstract: A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel.

Abstract: A multi-chip IC package encapsulates a chip under asymmetric longer single-side leads. The package mainly comprises a plurality of leads that have asymmetric length at two sides of a leadframe, a plurality of die-attach tape strips, a first chip having a plurality of single-side pads under the longer side leads, at least a second chip disposed above the longer side leads, a plurality of bonding wires and a molding compound. The die-attach tape strips are mutually parallel and adhered onto the lower surfaces of the longer side leads to adhere the first chip. There is at least a mold-flow channel formed through the first chip, the longer side leads and the die-attach tape strips. The bonding wires electrically connect the single-side pads of the first chip to the leads at the two sides of the leadframe through a non-central gap. The molding compound encapsulates the first chip, the second chip, the bonding wires and portions of the leads at the two sides of the leadframe and fills up the mold-flow channel.

Abstract: A stacking structure of chip package disclosed herein includes a lead frame having a plurality of supporting fingers and a plurality of leads; a first chip arranged on one side of the lead frame by utilizing a first connecting element so as to partially cover these supporting fingers, wherein the supporting fingers stretch from the edge of the first chip toward the first chip to provide a support; a second chip arranged on the opposite side of the lead frame at the corresponding position of the first chip by utilizing a second connecting element to partially covering the supporting fingers, wherein the first chip, the second chip and the partially-covered supporting fingers are cooperated to define an open mold-flowing trench; an electrical-connecting element to electrically connect the first chip, the second chip and the leads; and a molding compound utilized to cover the first chip, the second chip, the electrical-connecting element and some of the lead frame, wherein the molding compound flows through the