Patents by Inventor Tseng-Wei Weng

Tseng-Wei Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Communication device with ground plane antenna
    Patent number: 9431696
    Abstract: A communication device including a ground element, a dielectric substrate, and an antenna element is provided. The dielectric substrate is disposed nearby the ground element and has a first surface and a second surface. The antenna element includes a first metal portion and a second metal portion. The first metal portion is disposed on the first surface and has a feeding point. The second metal portion is disposed on the second surface. The first metal portion is electrically connected to the second metal portion through a conductive via-hole, and the conductive via-hole is located at or nearby a first edge of the first metal portion. The first edge is away from the ground element. The projection of the second metal portion on the first surface is covered by the first metal portion.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: August 30, 2016
    Assignee: Acer Incorporated
    Inventors: Kin-Lu Wong, Tseng-Wei Weng
  • Communication device
    Patent number: 9124002
    Abstract: A communication device including a first antenna, a second antenna, a ground element, and an isolation element is provided. The ground element is coupled to a conductive plane. The isolation element is disposed between the first antenna and the second antenna and includes a first portion and a second portion. A first end of the first portion and a first end of the second portion are respectively coupled to the ground element, and a second end of the first portion is spaced apart a coupling distance from a second end of the second portion.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: September 1, 2015
    Assignee: Acer Incorporated
    Inventors: Kin-Lu Wong, Tseng-Wei Weng
  • COMMUNICATION DEVICE WITH GROUND PLANE ANTENNA
    Publication number: 20140327593
    Abstract: A communication device including a ground element, a dielectric substrate, and an antenna element is provided. The dielectric substrate is disposed nearby the ground element and has a first surface and a second surface. The antenna element includes a first metal portion and a second metal portion. The first metal portion is disposed on the first surface and has a feeding point. The second metal portion is disposed on the second surface. The first metal portion is electrically connected to the second metal portion through a conductive via-hole, and the conductive via-hole is located at or nearby a first edge of the first metal portion. The first edge is away from the ground element. The projection of the second metal portion on the first surface is covered by the first metal portion.
    Type: Application
    Filed: July 24, 2013
    Publication date: November 6, 2014
    Applicant: Acer Incorporated
    Inventors: Kin-Lu Wong, Tseng-Wei Weng
  • COMMUNICATION DEVICE
    Publication number: 20140139392
    Abstract: A communication device including a first antenna, a second antenna, a ground element, and an isolation element is provided. The ground element is coupled to a conductive plane. The isolation element is disposed between the first antenna and the second antenna and includes a first portion and a second portion. A first end of the first portion and a first end of the second portion are respectively coupled to the ground element, and a second end of the first portion is spaced apart a coupling distance from a second end of the second portion.
    Type: Application
    Filed: January 16, 2013
    Publication date: May 22, 2014
    Applicant: ACER INCORPORATED
    Inventors: Kin-Lu Wong, Tseng-Wei Weng