Patents by Inventor Tseng-Yang Hsu
Tseng-Yang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8089294Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.Type: GrantFiled: August 5, 2008Date of Patent: January 3, 2012Assignee: WinMENS Technologies Co., Ltd.Inventors: Tseng-Yang Hsu, Cao Ngoc Lam
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Patent number: 7928751Abstract: A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.Type: GrantFiled: February 18, 2009Date of Patent: April 19, 2011Assignee: WinMEMS Technologies Holdings Co., Ltd.Inventor: Tseng-Yang Hsu
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Patent number: 7811849Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform. The method further comprises placing the MEMS part into the opening of the guiding mask on the application platform, and removing the guiding mask from the application platform after the MEMS part is bonded to the application platform.Type: GrantFiled: January 30, 2008Date of Patent: October 12, 2010Assignee: WinMEMS Technologies Co., Ltd.Inventor: Tseng-Yang Hsu
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Publication number: 20100207654Abstract: A Micro-Electro-Mechanical-Systems (MEMS) interconnection pin is fabricated on a sacrificial layer, which is formed on a conductive layer and a substrate. The MEMS interconnection pin has a pin base attached to a frame that has direct contact to the conductive layer. The sacrificial layer is then removed, at least partially, to detach the MEMS interconnection pin from the substrate. In one embodiment, the MEMS interconnection pin has a pin base, two springs extending out from two different surfaces of the pin base, and a tip portion attached to each spring. The tip portions include one or more contact tips to make contact to conductive subjects.Type: ApplicationFiled: February 18, 2009Publication date: August 19, 2010Applicant: WinMEMS Technologies Holdings Co., Ltd.Inventor: Tseng-Yang Hsu
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Patent number: 7737714Abstract: A probe array is assembled on a probe card platform. Each of the probes in the probe array has a probe base that includes a gripping handle. The probe bases have two or more different shapes. The probe bases of different shapes are interleaved such that any two adjacent probes on the platform have probe bases of different shapes. The arrangement of the probes increases effective spacing between the probes to facilitate the maneuvering of a handling tool.Type: GrantFiled: November 5, 2008Date of Patent: June 15, 2010Assignee: WinMEMS Technologies Holdings Co., Ltd.Inventor: Tseng-Yang Hsu
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Publication number: 20100109698Abstract: A probe array is assembled on a probe card platform. Each of the probes in the probe array has a probe base that includes a gripping handle. The probe bases have two or more different shapes. The probe bases of different shapes are interleaved such that any two adjacent probes on the platform have probe bases of different shapes. The arrangement of the probes increases effective spacing between the probes to facilitate the maneuvering of a handling tool.Type: ApplicationFiled: November 5, 2008Publication date: May 6, 2010Inventor: Tseng-Yang Hsu
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Publication number: 20100033201Abstract: A Micro-Electro-Mechanical-Systems (MEMS) probe is fabricated on a substrate for use in a probe card. The probe has a bonding surface to be attached to an application platform of the probe card. The bonding surface is formed on a plane perpendicular to a surface of the substrate. An undercut is formed beneath the probe for detachment of the probe from the substrate.Type: ApplicationFiled: August 5, 2008Publication date: February 11, 2010Inventors: Tseng-Yang Hsu, Cao Ngoc Lam
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Publication number: 20090191661Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform. The method further comprises placing the MEMS part into the opening of the guiding mask on the application platform, and removing the guiding mask from the application platform after the MEMS part is bonded to the application platform.Type: ApplicationFiled: January 30, 2008Publication date: July 30, 2009Inventor: Tseng-Yang Hsu
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Publication number: 20090144970Abstract: A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises fabricating a MEMS part on a substrate, and detaching the MEMS part from the substrate. After detaching the MEMS part from the substrate, attaching the MEMS part to an application platform.Type: ApplicationFiled: December 6, 2007Publication date: June 11, 2009Inventors: Tseng-Yang Hsu, Chih-Hsiang Lai
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Patent number: 7271022Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: GrantFiled: April 11, 2005Date of Patent: September 18, 2007Assignee: Touchdown Technologies, Inc.Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Hak Tea, Melvin B Khoo, Raffi Garabedian, Lakshimikanth Namburi
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Patent number: 7264984Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: GrantFiled: December 21, 2004Date of Patent: September 4, 2007Assignee: Touchdown Technologies, Inc.Inventors: Raffi Garabedian, Salleh Ismail, Nim Hak Tea, Tseng-Yang Hsu, Melvin B Khoo, Weilong Tang
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Publication number: 20060134819Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: ApplicationFiled: December 21, 2004Publication date: June 22, 2006Applicant: Integrated Micromachines, Inc.Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Tea, Melvin Khoo, Raffi Garabedian
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Publication number: 20060134820Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal.Type: ApplicationFiled: April 11, 2005Publication date: June 22, 2006Inventors: Weilong Tang, Tseng-Yang Hsu, Salleh Ismail, Nim Tea, Melvin Khoo, Raffi Garabedian, Lakshmikanth Namburi
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Patent number: 6806593Abstract: An electret formed by micro-machining technology on a support surface, including a self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. The electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×10−5 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge. An open circuit sensitivity of about 0.5 mV/Pa has been achieved for a hybrid microphone package.Type: GrantFiled: May 15, 2001Date of Patent: October 19, 2004Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh
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Patent number: 6343178Abstract: This invention provides a very sensitive optical attenuator, which can be used to couple and attenuate optical signals between optical fibers with a wide range of attenuation level. Such an optical attenuator includes a flexible conductive membrane to be moved by an external force, such as electrostatic force, to achieve deformation of the conductive membrane. The conductive membrane can be formed, for example, by a vacuum deposited silicon nitride film. A thin metallic, conductive layer is then deposited on the flexible membrane to form a reflective mirror to receive and reflect incident optical signals. The semiconductor structure includes one or more spacing posts, with which the first structural member is to be joined and bonded. Electrodes are placed on the semiconductor structure in close proximity to the flexible membrane.Type: GrantFiled: November 7, 2000Date of Patent: January 29, 2002Assignee: Integrated Micromachines, Inc.Inventors: Brent E. Burns, Tseng-Yang Hsu
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Publication number: 20010033670Abstract: An electret formed by micro-machining technology on a support surface, including a self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. The electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×10−5 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge. An open circuit sensitivity of about 0.5 mV/Pa has been achieved for a hybrid microphone package.Type: ApplicationFiled: May 15, 2001Publication date: October 25, 2001Applicant: California Institute of Technology a California Institute of TechnologyInventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh
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Patent number: 6243474Abstract: A small, inexpensive, high quality electret formed by micro-machining technology on a support surface, and further including a small, inexpensive, high quality, self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a highly reliable, inexpensive microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. In the preferred embodiment, the electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×105 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge.Type: GrantFiled: April 18, 1997Date of Patent: June 5, 2001Assignee: California Institute of TechnologyInventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh
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Patent number: 5821596Abstract: A micro-switch having a flexible conductive membrane which is moved by an external force, such as pressure from an air flow, to establish a connection between contact pads. The conductive membrane is stretched over one or more spacer pads to introduce deformation in the conductive membrane, thereby improving the accuracy and repeatability of the micro-switch. The spacing between the contact pads and the conductive membrane is precisely controlled by controlling the height difference between the spacer pads and the conductive pads. This height difference is determined by one or more precisely controlled etch operations.Type: GrantFiled: March 24, 1997Date of Patent: October 13, 1998Assignee: Integrated Micromachines, Inc.Inventors: Denny K. Miu, James R. W. Clymer, Paul A. Endter, Viktoria A. Temesvary, Tseng-Yang Hsu, Weilong Tang