Patents by Inventor Tseng-Yu Shu

Tseng-Yu Shu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060266052
    Abstract: A passive thermoacoustic cooling apparatus for cooling of components such as miniaturized microelectronics is disclosed. The passive thermoacoustic cooling apparatus includes resonant cavities, a temperature-difference element and a heat conduction element. The temperature-difference element is integrated with the system of resonant cavities for conversion of heat into acoustic power. The heat conducting element connects a heat source to the temperature-difference element, which transmits heat from the source to one end of the temperature-difference component. Due to established temperature gradient across hot and cold ends of the temperature-difference element, acoustic standing wave arises in the resonant cavity system. Forced air convection is thereby generated to cool the heat source.
    Type: Application
    Filed: May 5, 2006
    Publication date: November 30, 2006
    Inventors: Pen -Yuan Hsing, Wei-Kang Huang, Tseng-Yu Shu, Ming-Te Wu, Liang-Chao Chang, Pao-Jeng Sheng, Chih Lee, Chih-Chiang Cheng, Wen Hsiao