Abstract: A passive thermoacoustic cooling apparatus for cooling of components such as miniaturized microelectronics is disclosed. The passive thermoacoustic cooling apparatus includes resonant cavities, a temperature-difference element and a heat conduction element. The temperature-difference element is integrated with the system of resonant cavities for conversion of heat into acoustic power. The heat conducting element connects a heat source to the temperature-difference element, which transmits heat from the source to one end of the temperature-difference component. Due to established temperature gradient across hot and cold ends of the temperature-difference element, acoustic standing wave arises in the resonant cavity system. Forced air convection is thereby generated to cool the heat source.