Patents by Inventor Tsing-Jen Chen

Tsing-Jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for preparing patterned substrate by using nano- or micro- particles
    Patent number: 8367446
    Abstract: A method for preparing patterned substrate by using nano- or micro-particles is disclosed, which comprises the following steps: (A) providing a substrate with a photoresist layer formed thereon; (B) coating a surface of the photoresist layer with plural nano- or micro-particles, to form a particle layer; (C) exposing and developing the photoresist layer to obtain a patterned photoresist layer; and (D) removing the particle layer. In addition, after the particle layer is removed, the method of the present invention further comprises: (E1) using the patterned photoresist layer as an etching template to etch the substrate; and (E2) removing the patterned photoresist layer to obtain a patterned substrate with plural cavities formed thereon.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: February 5, 2013
    Assignee: National Central University
    Inventors: Chia-Hua Chan, Chia-Hung Hou, Tsing-Jen Chen, Chii-Chang Chen
  • METHOD FOR PREPARING PATTERNED SUBSTRATE BY USING NANO- OR MICRO- PARTICLES
    Publication number: 20110111598
    Abstract: A method for preparing patterned substrate by using nano- or micro-particles is disclosed, which comprises the following steps: (A) providing a substrate with a photoresist layer formed thereon; (B) coating a surface of the photoresist layer with plural nano- or micro-particles, to form a particle layer; (C) exposing and developing the photoresist layer to obtain a patterned photoresist layer; and (D) removing the particle layer. In addition, after the particle layer is removed, the method of the present invention further comprises: (E1) using the patterned photoresist layer as an etching template to etch the substrate; and (E2) removing the patterned photoresist layer to obtain a patterned substrate with plural cavities formed thereon.
    Type: Application
    Filed: May 18, 2010
    Publication date: May 12, 2011
    Inventors: Chia-Hua Chan, Chia-Hung Hou, Tsing-Jen Chen, Chii-Chang Chen