Patents by Inventor Tsoring-Dih Yuan

Tsoring-Dih Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal dissipation of integrated circuits using diamond paths
    Patent number: 5313094
    Abstract: A heat dissipation apparatus for dissipation of thermal energy from an isolated active silicon region to an underlying supportive substrate is disclosed. Such an apparatus comprises a diamond filled trench having walls extending through the isolated active silicon region, an underlying insulative layer, and into the supportive substrate, whereby said diamond filled trench provides a high thermal conductive path from said active silicon region to said substrate.
    Type: Grant
    Filed: January 28, 1992
    Date of Patent: May 17, 1994
    Assignee: International Business Machines Corportion
    Inventors: Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu, David E. Kotecki, Tsoring-Dih Yuan