Patents by Inventor Tsrong Yi Wen

Tsrong Yi Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic precipitator
    Patent number: 9808808
    Abstract: An electrostatic precipitator is constructed with collecting and repelling electrodes. The collecting electrode is partially shielded from gas shear forces by a shielding structure. The shielding structure is mounted to reduce gas flow along a surface of the collector and includes passages for charged particles to travel to be captured by the collector.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: November 7, 2017
    Assignee: University of Washington
    Inventors: Tsrong-Yi Wen, Alexander V. Mamishev
  • Electrostatic Precipitator
    Publication number: 20160074878
    Abstract: An electrostatic precipitator is constructed with collecting and repelling electrodes. The collecting electrode is partially shielded from gas shear forces by a shielding structure. The shielding structure is mounted to reduce gas flow along a surface of the collector and includes passages for charged particles to travel to be captured by the collector.
    Type: Application
    Filed: September 11, 2015
    Publication date: March 17, 2016
    Inventors: Tsrong-Yi Wen, Alexander V. Mamishev
  • MULTI-CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
    Publication number: 20080164620
    Abstract: A multi-chip package including a carrier, at least one first chip, and a second chip is provided. The first chip is electrically connected to the carrier and disposed on the carrier. The second chip is electrically connected to the first chip and the carrier. A part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier. A method of fabricating the multi-chip package is also provided.
    Type: Application
    Filed: February 27, 2007
    Publication date: July 10, 2008
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Yu-Yu Lin, Tsrong-Yi Wen
  • Semiconductor package system and method of improving heat dissipation of a semiconductor package
    Publication number: 20080001277
    Abstract: A semiconductor package system which includes a base circuit board, a semiconductor package mounted on the base circuit board, and a heat dissipation component having a first contacting area for making a first connection with an upper portion of the semiconductor package and a second contacting area for making a second connection with the base circuit board is disclosed. A method of improving heat dissipation of a semiconductor package is also disclosed.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Tsrong Yi Wen, I-Ting Tsai, Enboa Wu