Patents by Inventor Tsu-An Han

Tsu-An Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED array package structure and method thereof
    Patent number: 7239333
    Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.
    Type: Grant
    Filed: January 21, 2005
    Date of Patent: July 3, 2007
    Assignee: Opto Tech Corporation
    Inventors: Shun-Lih Tu, Chih-Hung Chuang, Huai-Ku Chung, Chia-Feng Yang, Cheng-Wei Yang, Tsu-An Han, Hung-Tung Wang, Chien-Chen Hung
  • LED array package structure and method thereof
    Publication number: 20060132578
    Abstract: According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.
    Type: Application
    Filed: January 21, 2005
    Publication date: June 22, 2006
    Inventors: Shun-Lih Tu, Chih-Hung Chuang, Huai-Ku Chung, Chia-Feng Yang, Cheng-Wei Yang, Tsu-An Han, Hung-Tung Wang, Chien-Chen Hung
  • High power LED array
    Publication number: 20060049475
    Abstract: The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.
    Type: Application
    Filed: March 8, 2005
    Publication date: March 9, 2006
    Inventors: Hung-Tung Wang, Chien-Chen Hung, Shun-Lih Tu, Dennis Yen, Chih-Hung Chuang, Huai-Ku Chung, Cheng-Wei Yang, Tsu-An Han