Abstract: In one embodiment, a stereo effect enhancement method, comprising: receiving a first multimedia stream and a second multimedia stream, the second multimedia stream comprising a second frame at a second depth and the first multimedia stream comprising a first frame at a first depth that is to be presented within the second frame; adjusting a difference between the first and second depths by reducing parallax between the first and second frames; and adding a border around the first frame, wherein the adjusting and adding provide a more visually satisfying presentation of stereoscopic content corresponding to the first and second frames, the receiving, adjusting, and adding performed by a processor.

Abstract: A chemical sensor having a sol-gel material affixable to a predetermined surface, and an indicator within the sol-gel, for detecting and signaling the presence of at least one chemical is provided. Also provided is an indicator for detecting and indicating a presence of at least one chemical. The indicator includes a sol-gel material affixable to a predetermined surface and an indicator within the sol-gel, for detecting and signaling the presence of at least one chemical. There is provided a method of detecting at least one chemical by applying the indicator from above to a predetermined surface of an object and indicating the presence of a chemical. A method of making a chemical sensor encapsulating within a sol-gel a detector capable of detecting and signaling a presence of at least one chemical.

Abstract: A method of cooling a device, by applying a molecular fan thin film to a heat sink surface of the device, dissipating heat from the device by emitting infrared radiation, and cooling the device.

Abstract: A method of cooling a device, by applying a molecular fan thin film to a heat sink surface of the device, dissipating heat from the device by emitting infrared radiation, and cooling the device.

Abstract: A molecular fan for dissipating heat, the fan having a chemically functionalized molecular fan thin film coating affixed to a surface in need of heat dissipation. A nanocoating for dissipating heat, the coating having a thin film coating affixed to a surface in need of heat dissipation. A molecular fan thin film coating affixed to a surface in need of heat dissipation for dissipating heat.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: Electroless NiWP layers are used for TFT Cu gate process. The NiWP deposition process comprises the following steps. (a) Cleaning of the base surface using for example UV light, ozone solution and/or alkaline mixture solution, (b) micro-etching of the base surface using, e.g. diluted acid, (c) catalyzation of the base surface using, e.g. SnCl<SUB>2</SUB> and PdCl<SUB>2</SUB> solutions, (d) conditioning of the base surface using reducing agent solution, and (e) NiWP deposition. It has been discovered that NiWP layers deposited under certain conditions could provide good adhesion to the glass substrate and to the Cu layer with a good Cu barrier capability. A NiWP layer in useful for adhesion, capping and/or barrier layers for TFT Cu gate process (e.g. for flat screen display panels).

Abstract: A molecular fan for dissipating heat, the fan having a chemically functionalized molecular fan thin film coating affixed to a surface in need of heat dissipation. A nanocoating for dissipating heat, the coating having a thin film coating affixed to a surface in need of heat dissipation. A molecular fan thin film coating affixed to a surface in need of heat dissipation for dissipating heat.

Abstract: A blower comprises a housing and an impeller. The housing comprises a side outlet and an inlet comprising a predetermined profile, and the impeller is disposed in the housing. The predetermined profile is quadratrical, elliptical, polygonal, non-coaxial circle, or irregularly closed shaped. A flow tunnel is disposed between the impeller and the housing.

Abstract: A chemical sensor having a sol-gel material affixable to a predetermined surface, and an indicator within the sol-gel, for detecting and signaling the presence of at least one chemical is provided. Also provided is an indicator for detecting and indicating a presence of at least one chemical. The indicator includes a sol-gel material affixable to a predetermined surface and an indicator within the sol-gel, for detecting and signaling the presence of at least one chemical. There is provided a method of detecting at least one chemical by applying the indicator from above to a predetermined surface of an object and indicating the presence of a chemical. A method of making a chemical sensor encapsulating within a sol-gel a detector capable of detecting and signaling a presence of at least one chemical.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: A specially designed transparent electrode for plasma display panel is disclosed. The transparent electrodes are disposed in pairs on the front glass substrate of the panel spaced apart and parallel to each other. The paired transparent electrodes X and Y are characterized by having respectively an extension member Xn and an extension member Yn projected from the opposing side of a strip-shaped base corresponding to each discharge cell of the panel. The extension member Xn and extension member Yn are asymmetrical in shape and spaced apart a predetermined distance, so as to enhance its field effect in the discharge cell with the address electrode on the rear substrate and increase the illumination efficiency of the discharge cell. In addition, the distances between extension member Xn and extension member Yn of each paired transparent electrodes X and Y corresponding to the red, green and blue discharge cells (R, G, B) in each pixel of the PDP are unequal.

Abstract: Chromium-free coating composition with anti-corrosion and anti-fingerprint properties, particularly suitable for metal alloys, especially galvanized steel, and coated articles. Composition comprises aqueous-resin emulsion, hazardous air pollutant-free co-solvent, organo-functional silane, metal chelating agent, and chromium-free corrosion inhibitor, and optionally pH adjusting agent.

Abstract: A film having a large thin layer, preferably of a nano-micrometer thickness, of at least one perovskite magnanite. A coating for blocking EMIs, in particular the directed energy pulses, said coating comprising at least one nanostructured perovskite manganite in an environmentally friendly carrier. A method of protecting a surface by applying coating having at least one perovskite manganite in an environmentally friendly carrier. A barrier coating having at least one perovskite manganite in an environmentally friendly carrier.

Abstract: An emulsion for preparing a low-conductivity surface for powder coating, the emulsion including an emulsified organofunctional silane solution. A pre-powder coating emulsion provides a surface with conductivity. A non-conductive object having applied to an exterior surface of the object the emulsion including an emulsified organofunctional silane solution.

Abstract: An improved method of preventing copper poisoning in the fabrication of metal interconnects on a semiconductor substrate comprises sequential formation of a copper layer, a first stop layer, a first inter-metal dielectric layer, a second stop layer, and a second inter-metal dielectric layer over the substrate. The second inter-metal dielectric layer and the second stop layer are defined to form an opening. A conformal first glue/barrier layer is formed over the substrate. The first glue/barrier layer and the first inter-metal dielectric layer are patterned to form a via hole below the opening until the first stop layer is exposed. Spacers are formed on sidewalls of the opening and the via hole below the opening. The first stop layer at bottom of the via hole is removed to expose the copper layer.

Abstract: An improved method for fabricating metal interconnects on a semiconductor substrate comprises sequential formation of a copper layer, a first stop layer, a first inter-metal dielectric layer, a second stop layer, and a second inter-metal dielectric layer over the substrate. The second inter-metal dielectric layer and the second stop layer are defined to form an opening. A conformal first glue/barrier layer is formed over the substrate. The first glue/barrier layer and the first inter-metal dielectric layer are defined to form a via hole above the opening until the first stop layer is exposed. Spacers are formed on sidewalls of the opening and the via hole above the opening. The first stop layer at bottom of the via hole is removed to expose the copper layer.