Abstract: A method includes forming a gate stack, which includes a gate dielectric and a metal gate electrode over the gate dielectric. An inter-layer dielectric is formed on opposite sides of the gate stack. The gate stack and the inter-layer dielectric are planarized. The method further includes forming an inhibitor film on the gate stack, with at least a portion of the inter-layer dielectric exposed, selectively depositing a dielectric hard mask on the inter-layer dielectric, with the inhibitor film preventing the dielectric hard mask from being formed thereon, and etching to remove a portion of the gate stack, with the dielectric hard mask acting as a portion of a corresponding etching mask.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.

Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.

Abstract: A semiconductor package is provided in the present disclosure. The semiconductor package comprises: a substrate, an electronic device disposed on the substrate, a lid disposed on the substrate and surrounding the electronic device an encapsulant formed over the substrate, encapsulating the electronic device and the lid; and a plurality of fillers in the encapsulant, configured to diffuse light interacting with the electronic device. In this way, through the use of the encapsulant including the fillers distributed therein, additional optical filters and diffusers are not needed. Also, through the use of the lid, undesired stray light can be prevented from being interacting with the electronic device.

Abstract: A package structure is provided. The package structure includes a substrate, a sensor device, an encapsulant and a signal blocking structure. The substrate has a signal passing area. The sensor device is disposed over the substrate. The sensor device has a first surface, a second surface opposite to the first surface and a sensing area located at the second surface. The second surface of the sensor device faces the substrate. The encapsulant covers the sensor device and the substrate. The signal blocking structure extends from the substrate into the encapsulant.

Abstract: An optical sensor package structure and an optical module structure are provided. The optical sensor package structure includes a substrate, a sensor device and a transparent encapsulant. The sensor device is electrically connected to the substrate, and has a sensing area facing the substrate. The transparent encapsulant covers the sensing area of the sensor device.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: A semiconductor device package includes a carrier provided with a first conductive element, a second conductive element arranged on a semiconductor disposed on the carrier, and a second semiconductor device disposed on and across the first conductive element and the first semiconductor device, wherein the first conductive element having a surface that is substantially coplanar with a surface of the second conductive element.

Abstract: An optical engine assembly includes a bench, an optoelectronic device, a fixed member and a plurality of fibers. The bench has a bearing surface and an extended sidewall with a predetermined height from the bearing surface. The sidewall has an upper surface parallel to the bearing surface. The optoelectronic device is disposed on the center of the upper surface and includes a plurality of active areas. The fixed member is disposed on the bearing surface and has a plurality of through holes and two pin holes. The fibers respectively pass through the through holes and a 45-degree beveled surface is formed at the front end of each fiber. The 45-degree beveled surfaces are aligned with the active areas, respectively.

Abstract: An optical engine assembly includes a bench, an optoelectronic device, a fixed member and a plurality of fibers. The bench has a bearing surface and an extended sidewall with a predetermined height from the bearing surface. The sidewall has an upper surface parallel to the bearing surface. The optoelectronic device is disposed on the center of the upper surface and includes a plurality of active areas. The fixed member is disposed on the bearing surface and has a plurality of through holes and two pin holes. The fibers respectively pass through the through holes and a 45-degree beveled surface is formed at the front end of each fiber. The 45-degree beveled surfaces are aligned with the active areas, respectively.

Abstract: An optical interconnection transceiver module comprises a printed circuit board, a carrier, an optical interconnection device and a light-guiding module. The printed circuit board comprises a first area and a second area. The carrier is disposed at the first area of the printed circuit board to make the flexibility of the first area lower than that of the second area. The optical interconnection device is disposed on the carrier and electrically connected with the printed circuit board. The light-guiding module comprises a case disposed on the carrier and at least one reflective mirror. The case comprises a first accommodating slot, a first light channel and a second light channel in communication with the first accommodating slot and the first light channel. The reflective mirror is disposed at the first light channel, and the optical interconnection device is corresponded to the reflective mirror via the first light channel.

Abstract: There is provided an optical engine assembly including a bench, at least one optoelectronic unit, at least one optical waveguide and a mount. At least one support groove and a positioning groove are formed on the bench and connected with each other, and the support groove perpendicularly extends outward from one side of the positioning groove. The optoelectronic unit is disposed at the other side of the positioning groove and aligned with the support groove. One end of the optical waveguide is placed inside the support groove and the other end thereof penetrates through at least one through hole of the mount.