Abstract: A manufacturing method of heat conductive device for an LED has steps of forming a heat sink and an engagement recess in the heat sink by cold forge, punching a heat-conducting disc to form an LED carrier having a mounting portion and a heat-conducting wall formed around the mounting portion, soldering multiple LEDs on the LED carrier, and heating the heat sink to thermally expand the heat sink and assembling the LED carrier and the heat sink so that the heat-conducting wall is assembled with the engagement recess and further chilling the heat sink to thermally retract and tightly hold the LED carrier. The manufacturing method increases contact area and reduces air gaps between the LED carrier and the heat sink to effectively enhance the heat-conducting efficiency of the LED carrier so that the LEDs are operated at a suitable operating temperature to secure a prolonged life duration.

Abstract: A heat conductive device for an LED has a heat sink and an LED carrier tightly fitted in the heat sink. The LED carrier has a mounting portion formed on one end thereof and having a first heat-conducting surface formed on a top of the mounting portion, and a heat-conducting portion formed along a perimeter of the mounting portion and having a second heat-conducting surface formed on the periphery of the heat-conducting portion. The first and second heat-conducting surfaces contact the engagement portion of the heat sink so that heat generated by LED operation is conducted to the heat sink through the heat-conducting portion, the first heat-conducting surface and the second heat-conducting surface. With the second heat-conducting surface of the LED carrier, heat can be more efficiently conducted to the heat sink and LEDs can be operated at an adequate operating temperature to prolong their life duration.

Abstract: A manufacturing method of heat conductive device for an LED has steps of forming a heat sink and an engagement recess in the heat sink by cold forge, punching a heat-conducting disc to form an LED carrier having a mounting portion and a heat-conducting wall formed around the mounting portion, soldering multiple LEDs on the LED carrier, and heating the heat sink to thermally expand the heat sink and assembling the LED carrier and the heat sink so that the heat-conducting wall is assembled with the engagement recess and further chilling the heat sink to thermally retract and tightly hold the LED carrier. The manufacturing method increases contact area and reduces air gaps between the LED carrier and the heat sink to effectively enhance the heat-conducting efficiency of the LED carrier so that the LEDs are operated at a suitable operating temperature to secure a prolonged life duration.

Abstract: An LED lighting device having heat convection and heat conduction effects has a heat dissipating assembly, a substrate, multiple LEDs and a base. The heat dissipating assembly has a housing and an outer cover. The housing has multiple air holes. The outer cover is mounted on an open top of the housing and has multiple through holes and an exterior flue protruding from the outer cover and extending into the housing. The substrate is mounted inside the housing against the outer cover and has a hole allowing the exterior flue to extend therethrough. The LEDs are mounted on the substrate and respectively correspond to the through holes. The base is attached to a bottom of the housing. The exterior flue encourages heated air to move through the exterior flue and flow out of the housing via the air holes. With such continuous and directional air movement, the LED lighting device obtains good heat-dissipating efficiency.

Abstract: An LED module comprises a heat dissipating bracket, a substrate, multiple LED assemblies and two rotatable mounting assemblies. The heat dissipating bracket has a top panel, a bottom panel and multiple flues. Each flue connects a corresponding top hole of the top panel and a bottom hole of the bottom panel. The substrate is mounted on the bottom panel and has multiple independent through holes respectively corresponding to the flues. The LED assemblies are respectively mounted on the substrate between two adjacent through holes. The rotatable mounting assemblies are respectively connected to two ends of the heat dissipating bracket, wherein the heat dissipating bracket is adapted to change an illuminating direction of the LED assemblies by rotating with the rotatable mounting assemblies. With the heat dissipating bracket and the rotatable mounting assemblies, the LED module obtains good heat-dissipating efficiency and optimal light distribution.

Abstract: An LED lighting device having heat convection and heat conduction effects has a heat dissipating assembly, a substrate, multiple LEDs and a base. The heat dissipating assembly has a housing and an outer cover. The housing has multiple air holes. The outer cover is mounted on an open top of the housing and has multiple through holes and an exterior flue protruding from the outer cover and extending into the housing. The substrate is mounted inside the housing against the outer cover and has a hole allowing the exterior flue to extend therethrough. The LEDs are mounted on the substrate and respectively correspond to the through holes. The base is attached to a bottom of the housing. The exterior flue encourages heated air to move through the exterior flue and flow out of the housing via the air holes. With such continuous and directional air movement, the LED lighting device obtains good heat-dissipating efficiency.