Patents by Inventor Tsu-Yang Wong

Tsu-Yang Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and electronic apparatus of the same
    Patent number: 8477511
    Abstract: A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 2, 2013
    Assignee: Amazing Microelectronic Corp.
    Inventors: Ho-Shyan Lin, Tsu-Yang Wong
  • PACKAGE STRUCTURE OF TRANSIENT VOLTAGE SUPPRESSOR
    Publication number: 20120327607
    Abstract: A package structure of transient voltage suppressor is disclosed. The package structure comprises a package housing with a bottom thereof having a first contact pin, a second contact pin, and a third contact pin, wherein the third contact pin is positioned between the first contact pin and the second contact pin. A first diode is positioned in the package housing, and an anode and a cathode of the first diode are respectively connected with the third contact pin and the first contact pin. A second diode is installed in the package housing, and an anode and a cathode of the second diode are respectively connected with the third contact pin and the second contact pin.
    Type: Application
    Filed: June 22, 2011
    Publication date: December 27, 2012
    Inventors: Ho-Shyan LIN, Tsu-Yang Wong
  • PACKAGE STRUCTURE AND ELECTRONIC APPARATUS OF THE SAME
    Publication number: 20110214902
    Abstract: A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.
    Type: Application
    Filed: September 2, 2010
    Publication date: September 8, 2011
    Applicant: AMAZING MICROELECTRONIC CORP.
    Inventors: Ho-Shyan Lin, Tsu-Yang Wong