Patents by Inventor Tsuan Ching KUO

Tsuan Ching KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING ELECTRICAL PACKAGE
    Publication number: 20230106612
    Abstract: A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Pin HUANG, Fu Tang CHU, Pei I CHANG, Chia Hao CHEN, Tsuan Ching KUO