Abstract: An object is to provide a zwitterionic compound having an excellent protein adsorption inhibitory effect. The zwitterionic compound is a polymer comprising a unit represented by the following formula (1): wherein R1 is a hydrogen atom or a methyl group, R2 is OH or O?, X1 is —O— or —N(Q1)-, Q1 is a hydrogen atom or a C1-6 alkyl group, m is an integer of 1 to 12, and n is an integer of 1 to 4.

Abstract: An adhesive tape or sheet comprises an adhesive layer which contains 0.3 to 10 parts by weight of an polyether polyol compound, and 0.005 to 2 parts by weight of at least one alkali metal salt for 100 parts by weight of an acrylic adhesive which is formed with a copolymer of methyl acrylate monomer, ethyl acrylate monomer, or methyl acrylate monomer and ethyl acrylate monomer, acrylate monomer, and 2-ethylhexyl acrylate monomer.

Abstract: According to the invention, a process for producing a semiconductor device using an adhesive sheet for a spacer, comprising preparing an adhesive sheet having a spacer layer provided with an adhesive layer on at least one surface thereof as the adhesive sheet for a spacer, a step of sticking the adhesive sheet for a spacer onto a dicing sheet with the adhesive layer as a sticking surface, a step of dicing the adhesive sheet for a spacer to form a chip-shaped spacer provided with the adhesive layer, a step of peeling the spacer from the dicing sheet together with the adhesive layer, and a step of fixing the spacer onto an adherend with the adhesive layer interposed therebetween.

Abstract: An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.

Abstract: The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.

Abstract: The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.

Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.

Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 ?m to 30 ?m. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage.

Abstract: An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive sheet has perforations, has a porosity of 3 to 90% and has a fracture elongation of at least 100%.

Abstract: An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and said adhesive sheet has an adhesive strength of at least 1.5 N/20 mm.