Patents by Inventor Tsubasa SAITO

Tsubasa SAITO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9909936
    Abstract: A heat flux sensor to be attached to a hole portion defined in a surface of an object includes a body portion having an outer circumferential face, and an exterior end face that is flush with the surface of the object. The body portion includes a plurality of bored holes extending from an outer face other than the exterior end face of the body portion, with respective tips of the bored holes being arranged on the same normal line of the exterior end face. The heat flux sensor further includes a plurality of heat sensors having wiring lines leading to the outer face of the body portion through the bored holes, and a filling material that fills the bored holes to seal the heat sensors.
    Type: Grant
    Filed: December 25, 2013
    Date of Patent: March 6, 2018
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Atsushi Moriwaki, Shinsuke Tajiri, Kazuhiro Kamaya, Masanori Tsubouchi, Tsubasa Saito, Kazuhiro Yamada
  • Publication number: 20150292961
    Abstract: A heat flux sensor to be attached to a hole portion formed in the surface of an object includes a body portion having an outer circumferential face that faces an inner circumferential face of the hole portion, and an exterior end face being flush with the surface of the object. The body portion is formed with a plurality of bored holes that extends from an outer face other than the exterior end face of the body portion, with respective tips of the bored holes being arranged on the same normal line of the exterior end face. The heat flux sensor is further provided with a plurality of heat sensors that have wiring lines leading to the outer face of the body portion through the bored holes, and a filling material that fills the bored holes to seal the heat sensors.
    Type: Application
    Filed: December 25, 2013
    Publication date: October 15, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Atsushi MORIWAKI, Shinsuke TAJIRI, Kazuhiro KAMAYA, Masanori TSUBOUCHI, Tsubasa SAITO, Kazuhiro YAMADA