Abstract: A semiconductor module includes a stacked substrate includes an insulating plate and first and second circuit boards arranged on the insulating plate, a semiconductor element arranged on the first circuit board, and a metal wiring board having a first bonding portion bonded to an upper surface of the semiconductor element via a first bonding material. The first bonding portion includes a first plate-shaped portion that has at a lower surface thereof, a boss protruding toward the semiconductor element, and at an upper surface thereof, a first recess at a position corresponding to a position immediately above the boss and multiple second recesses. At the upper surface of the first plate-shaped portion, each of the second recesses has an opening area smaller than an opening area of the first recess.

Abstract: Provided is a semiconductor module including: an insulating circuit board having a circuit pattern formed in one surface; a semiconductor chip placed in the insulating circuit board; and a wiring portion for electrically connecting the semiconductor chip and the circuit pattern. The wiring portion includes a chip connecting portion connected to the semiconductor chip. A surface of the chip connecting portion includes: a plurality of concave portions; and a flat portion disposed between two concave portions.