Patents by Inventor Tsuchin Chu

Tsuchin Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for analyzing a bondline
    Patent number: 9443300
    Abstract: A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison.
    Type: Grant
    Filed: September 15, 2014
    Date of Patent: September 13, 2016
    Assignee: The Boeing Company
    Inventors: Gary E. Georgeson, Anish Poudel, Tsuchin Chu, James A. Grossnickle
  • SYSTEMS AND METHODS FOR ANALYZING A BONDLINE
    Publication number: 20160078607
    Abstract: A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 17, 2016
    Inventors: Gary E. Georgeson, Anish Poudel, Tsuchin Chu, James A. Grossnickle
  • Double Core Biopsy Instrumentation Kit
    Publication number: 20080114265
    Abstract: A biopsy needle for collecting tissue samples includes a needle having a first cavity adapted for accepting a first sample core, the needle having a second cavity adapted for accepting a second sample core and a sheath with a single slot or opening and positioned coaxially with the needle. The needle with the sheath may have a separate core extraction kit.
    Type: Application
    Filed: October 23, 2006
    Publication date: May 15, 2008
    Inventors: Tom Tarter, Julia Tarter, Alay Manejain, Brad Schwartz, Tsuchin Chu