Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A physical quantity sensor includes an acceleration sensor having an acceleration sensor element and a package accommodating the acceleration sensor element, a support member having a first surface and supporting the acceleration sensor on the first surface, and an IC chip to which a second surface facing the first surface of the support member is attached, in which, in a plan view from a stacking direction of the acceleration sensor and the support member, in a case where an area of a region surrounded by an outer edge of the package is S1 and an area of the first surface is S2, S1?S2 is satisfied.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A physical quantity sensor includes: a base; an IC disposed on the base; an angular rate sensor and an acceleration sensor disposed on the IC; a first stress buffer layer disposed between the IC and the angular rate sensor; and a second stress buffer layer disposed between the IC and the acceleration sensor. The first and second stress buffer layers are disposed spaced apart from each other.

Abstract: A physical quantity sensor includes: an angular velocity detection element; an acceleration detection element; a bonding wire through which a detection signal of the acceleration detection element propagates; and a shield unit that is located between the angular velocity detection element and the bonding wire and is connected to a fixed potential. The angular velocity detection element and the acceleration detection element are disposed to be deviated in a height direction. At least a part of the shield unit is disposed between the angular velocity detection element and the acceleration detection element.

Abstract: A composite sensor includes a first shield pattern that functions as a noise shield of a circuit board, a second shield pattern that functions as a noise shield of a first sensor, and a third shield pattern that functions as a noise shield of a second sensor. The first shield pattern has an impedance lower than the second shield pattern and the third shield pattern. The second shield pattern and the third shield pattern are electrically connected to each other through the first shield pattern. Accordingly, deterioration of detection accuracy caused by electrical noise is restricted.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: A physical quantity sensor includes an acceleration sensor having an acceleration sensor element and a package accommodating the acceleration sensor element, a support member having a first surface and supporting the acceleration sensor on the first surface, and an IC chip to which a second surface facing the first surface of the support member is attached, in which, in a plan view from a stacking direction of the acceleration sensor and the support member, in a case where an area of a region surrounded by an outer edge of the package is S1 and an area of the first surface is S2, S1?S2 is satisfied.

Abstract: A composite sensor includes a first shield pattern that functions as a noise shield of a circuit board, a second shield pattern that functions as a noise shield of a first sensor, and a third shield pattern that functions as a noise shield of a second sensor. The first shield pattern has an impedance lower than the second shield pattern and the third shield pattern. The second shield pattern and the third shield pattern are electrically connected to each other through the first shield pattern. Accordingly, deterioration of detection accuracy caused by electrical noise is restricted.

Abstract: A physical quantity sensor includes: a base; an IC disposed on the base; an angular rate sensor and an acceleration sensor disposed on the IC; a first stress buffer layer disposed between the IC and the angular rate sensor; and a second stress buffer layer disposed between the IC and the acceleration sensor. The first and second stress buffer layers are disposed spaced apart from each other.

Abstract: A physical quantity sensor includes: an angular velocity detection element; an acceleration detection element; a bonding wire through which a detection signal of the acceleration detection element propagates; and a shield unit that is located between the angular velocity detection element and the bonding wire and is connected to a fixed potential. The angular velocity detection element and the acceleration detection element are disposed to be deviated in a height direction. At least a part of the shield unit is disposed between the angular velocity detection element and the acceleration detection element.

Abstract: To provide surface-emitting type semiconductor lasers and methods of manufacturing the same in which the polarization direction of laser light can be readily controlled, a surface-emitting type semiconductor laser includes a vertical resonator above a substrate. The vertical resonator includes a first mirror, an active layer and a second mirror disposed in this order from the substrate. The vertical resonator has a plurality of unit resonators. An emission region of each of the unit resonators has a diameter that oscillates in a single-mode.

Abstract: To provide surface-emitting type semiconductor lasers and methods of manufacturing the same in which the polarization direction of laser light can be readily controlled, a surface-emitting type semiconductor laser includes a vertical resonator above a substrate. The vertical resonator includes a first mirror, an active layer and a second mirror disposed in this order from the substrate. The vertical resonator has a plurality of unit resonators. An emission region of each of the unit resonators has a diameter that oscillates in a single-mode.

Abstract: To provide surface-emitting type semiconductor lasers and methods of manufacturing the same in which the polarization direction of laser light can be readily controlled, a surface-emitting type semiconductor laser includes a vertical resonator above a substrate. The vertical resonator includes a first mirror, an active layer and a second mirror disposed in this order from the substrate. The vertical resonator has a plurality of unit resonators. An emission region of each of the unit resonators has a diameter that oscillates in a single-mode.

Abstract: A surface-emitting type semiconductor laser includes a substrate; a first mirror disposed above the substrate; an active layer disposed above the first mirror; a second mirror disposed above the active layer; a first columnar section including the active layer, the first columnar section not having anisotropy; a first dielectric layer disposed in the first columnar section, the first dielectric layer including a symmetric opening section; a second columnar section disposed above the first columnar section, the second columnar section having an outer wall that has anisotropy; and a second dielectric layer disposed in the second columnar section, the second dielectric layer including an asymmetric opening section.

Abstract: A light emitting element driving circuit drives a surface-emitting element, and the light emitting element driving circuit is equipped with a bias current driving circuit that supplies a generally constant bias current to the surface-emitting element, a modulation current driving circuit that supplies to the surface-emitting element a modulation current superimposed on the bias current, and a temperature detection circuit that detects the temperature of the surface-emitting element, wherein the modulation current driving circuit decreases the current amount of the modulation current, when the temperature detected rises. The bias current driving circuit may preferably supply the bias current to the surface-emitting element through a coil, and the modulation current driving circuit may preferably supply the modulation current to the surface-emitting element through a capacitor.

Abstract: To provide optical modules and optical transmission devices that are suitable for communication forms using multimode optical fibers, an optical module includes a surface-emitting type semiconductor laser that emits polarized light oscillating in a multimode which is preferentially oriented in two given polarization axes, and an optical member that demonstrates at least one function among a transmission function, a reflection function, a refraction function, and a diffraction function alternatively to a predetermined polarization. The optical member is disposed such that a principal plane thereof intersects with a traveling direction of emission light of the surface-emitting type semiconductor laser and a polarization axis of the polarization plane does not overlap with the polarization axes of the emission light of the surface-emitting type semiconductor laser.

Abstract: This invention provides an optical transmitter in which reduced power consumption is achieved by, when a signal generator needs data transmission, driving a laser emitting device to perform emission. An optical transmitter includes a receiver, a laser driving circuit, a light emitting unit constituted by a plurality of laser emitting devices, and an EDID memory. The receiver and the laser driving circuit are supplied with power from a dedicated external power supply through a power-supply line, and the power-supply line is provided with a switch. The contact of the switch is controlled to open and close based on a power-supply voltage supplied from the DDC controller to the EDID memory.