Patents by Inventor Tsugio Koya

Tsugio Koya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5143355
    Abstract: Method and apparatus for manufacturing an oxygen-free copper having an oxygen content of no greater than 3 ppm by weight are disclosed. In the method, a deoxidizing step is carried out by bringing a reducing gas containing hydrogen gas into contact with a molten copper to react on the oxygen to remove the same. Then a dehydrogenation step may be carried out by bringing a gas of lean hydrogen concentration into contact with the molten copper. Accordingly, the apparatus has a deoxidizing device for blowing the reducing gas into the molten copper and preferably a dehydrogenation device.
    Type: Grant
    Filed: June 5, 1991
    Date of Patent: September 1, 1992
    Assignee: Mitsubishi Materials Corporation
    Inventors: Takuro Iwamura, Tsugio Koya, Izumi Sukekawa, Hideru Hagiwara, Haruhiko Asao, Toshiaki Shigematsu, Hideki Sato
  • Patent number: 5037471
    Abstract: Method and apparatus for manufacturing an oxygen-free copper having an oxygen content of no greater than 3 ppm by weight are disclosed. In the method, a deoxidizing step is carried out by bringing a reducing gas containing hydrogen gas into contact with a molten copper to react to the oxygen to remove the same. Then a dehydrogenation step may be carried out by bringing a gas of lean hydrogen concentration into contact with the molten copper. Accordingly, the apparatus has a deoxidizing device for blowing the reducing gas into the molten copper and preferably a dehydrogenation device.
    Type: Grant
    Filed: November 21, 1989
    Date of Patent: August 6, 1991
    Assignee: Mitsubishi Metal Corporation
    Inventors: Takuro Iwamura, Tsugio Koya, Izumi Sukekawa, Hideru Hagiwara, Haruhiko Asao, Toshiaki Shigematsu, Hideki Sato
  • Patent number: 4901550
    Abstract: In a method of manufacturing an extra fine wire, a blank wire cooled to a low temperature is caused to pass through a high humidity atmosphere and, immediately thereafter, is drawn to a diameter such that wire breakage due to the drawing does not occur. Alternatively, a blank wire is caused to pass through a die assembly so arranged as to be immersed in refrigerant, and is drawn within the refrigerant of low temperature, to a diameter with which wire breakage due to the drawing does not occur. The drawn wire material is heated rapidly and is annealed and, thereafter, is cooled rapidly to form an intermediate blank wire. Subsequently, the intermediate wire is drawn at the ordinary temperature.
    Type: Grant
    Filed: December 28, 1988
    Date of Patent: February 20, 1990
    Assignee: Mitsubishi Kinzoku Kabushiki Kaisha
    Inventors: Masato Koide, Takuro Iwamura, Tsugio Koya