Abstract: A device capable of improving quality of welding by improving estimation precision of coating removal completion of a conductor which is an ultrasonic welding target is provided. An ultrasonic vibration energy (E) of a horn (11) is adjusted based on magnitude of a displacement amount (a reference displacement amount (?Z)) of the horn (11) during at least a partial period of a period from a state in which an FFC and a PCB are interposed by the horn (11) and an anvil (12), through a “first stable state” in which a displacement speed (v) of the horn (11) is stable in a first speed zone in a course in which the displacement speed (v) of the horn (11) increases, until a “second stable state” in which the displacement speed (v) is stable in a second speed zone of a higher speed zone than the first speed zone.

Abstract: A PCB (1) has a reinforcing member (12) composed of a material having a higher melting point than a synthetic resin constituting a substrate (10). A first reinforcing member (121) constituting the reinforcing member (12) is composed of a substantially tabular or belt-shaped metal buried in the substrate (10), the metal being at least partially overlapped with an upper surface wire (11). A second reinforcing member (122) constituting the reinforcing member (12) is composed of a substantially columnar metal which is connected to the lower surface of the upper surface wire (11) and physically, chemically or mechanically connected to the first reinforcing member (121), and which vertically extends, in the same manner as a via (111).

Abstract: A device capable of improving estimation precision of coating removal completion of a conductor which is an ultrasonic welding target is provided. A displacement speed v of the horn (11) is chronologically measured. A progress situation of the melting and removal of an insulating coating C0 (a synthetic resin included in the insulating coating C0) between both conductors C1 and C2 which are welding targets is estimated based on a transition form from a “first stable state” in which the displacement speed v is stable in a first speed zone to a “second stable state” in which the displacement speed v is stable in a second speed zone of a higher speed zone than the first speed zone in a course in which the displacement speed v of the horn (11) increases.

Abstract: An electronic circuit board provided with a substrate, including a synthetic resin and having a conductor bonded to the upper surface, and an ultrasonic bonding method, the electronic circuit board and the ultrasonic bonding method enabling improved quality of bonding of another conductor to the conductor on the upper surface of the electronic circuit board. PCB (1) (an electronic circuit board) has a substrate (10) including first synthetic resin and a plurality of first conductors (11) bonded or attached to the upper surface of the substrate (10). The peripheral edge portion of the upper surface of each first conductor (11) is at least partly covered by a partial cover (12) (or an overlay) composed of second synthetic resin. The outer edge portion of the second synthetic resin constituting the partial cover (12) is integrally bonded to or in close contact with the first synthetic resin constituting the substrate (10).

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract: A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy.

Abstract: A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy.