Patents by Inventor Tsuguharu Miura

Tsuguharu Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antenna module and wireless communication apparatus
    Patent number: 8711039
    Abstract: An antenna module includes a base member made of a resin and a copper-foil material, a first ground layer formed on a first surface of the base member, a second ground layer formed on a second surface of the base member, and an inverted-F metal-plate antenna provided on the first surface, formed by punch-cutting and folding a metal plate and including a rectangular conductive plate, a grounding conductor portion connected to the first ground layer, and a feeding conductor portion connected to a feeding point. The rectangular conductive plate is folded at a folding portion extending in a length direction and is divided in a width direction at the folding portion into a first rectangular conductive plate and a second rectangular conductive plate. The first rectangular conductive plate is parallel to the base member whereas the second rectangular conductive plate is inclined to the base member.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: April 29, 2014
    Assignee: Sony Corporation
    Inventors: Shozo Horisawa, Kanahiro Shirota, Tsuguharu Miura
  • ANTENNA MODULE AND WIRELESS COMMUNICATION APPARATUS
    Publication number: 20120176275
    Abstract: An antenna module includes a base member made of a resin and a copper-foil material, a first ground layer formed on a first surface of the base member, a second ground layer formed on a second surface of the base member, and an inverted-F metal-plate antenna provided on the first surface, formed by punch-cutting and folding a metal plate and including a rectangular conductive plate, a grounding conductor portion connected to the first ground layer, and a feeding conductor portion connected to a feeding point. The rectangular conductive plate is folded at a folding portion extending in a length direction and is divided in a width direction at the folding portion into a first rectangular conductive plate and a second rectangular conductive plate. The first rectangular conductive plate is parallel to the base member whereas the second rectangular conductive plate is inclined to the base member.
    Type: Application
    Filed: January 5, 2012
    Publication date: July 12, 2012
    Applicant: SONY CORPORATION
    Inventors: Shozo Horisawa, Kanahiro Shirota, Tsuguharu Miura