Patents by Inventor Tsuguhiko Takamura

Tsuguhiko Takamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Impedance qualization module
    Patent number: 7200010
    Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: April 3, 2007
    Assignee: Thin Film Technology Corp.
    Inventors: Mark Hamilton Broman, Mike Howieson, Tsuguhiko Takamura, Mark Brooks, Yasutsugu Okamoto, Brent Huibregtse
  • Impedance equalization module
    Patent number: 6819569
    Abstract: A thin film circuit module for terminating circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein one of the capacitor plates defines a circuit resistor. The equalizer modules are serially coupled to trace conductors of a connector block. Another hybrid equalizer construction includes thin film resistors and pick-and-placed capacitors.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: November 16, 2004
    Assignee: Thin Film Technology Corp.
    Inventors: Mark Hamilton Broman, Mike Howieson, Brent Randel Huibregtse, Tsuguhiko Takamura
  • Impedance qualization module
    Publication number: 20040110421
    Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.
    Type: Application
    Filed: September 24, 2003
    Publication date: June 10, 2004
    Applicant: Thin Film Technology Corporation
    Inventors: Mark Hamilton Broman, Mike Howieson, Tsuguhiko Takamura, Mark Brooks, Yasutsugu Okamoto, Brent Huibregtse