Abstract: In a conventional optical device which mounts a semiconductor light emitting element, the processing is difficult and a manufacturing process cost is expensive because of the necessity of forming via holes in a substrate. An optical device comprises a laser diode which needs heat radiation, a glass substrate which is integrally molded into a mold glass for arranging the laser diode, a metallic heat sink arranged at an edge of the glass substrate for radiating heat generated from the laser diode, wherein an active layer proximity surface of the laser diode is arranged to oppose the heat sink, both of them are connected with a conductive paste through a lateral groove formed in the glass substrate.

Abstract: A thin imaging apparatus with an extremely low profile captures high quality images with outstanding resolution. The imaging apparatus has a light guide, incidence mirror, imaging device, and aperture unit. The incidence mirror reflects and guides light from a subject into the light guide, and the imaging device receives the light from the subject reflected by the incidence mirror and passing through the light guide.

Abstract: A first substrate on which an optical-waveguide groove is formed and a second substrate. The second substrate is bonded to the plane of the first substrate on which the optical-waveguide groove is formed by a material having a refractive index higher than those of the first substrate and second substrate. The optical-waveguide groove is filled with the material, and the refractive index of the first substrate is different from the refractive index of the second substrate.

Abstract: A micro-shape transcription method has preparing a mold having a transcription face on which a concavo-convex pattern is formed, pressing the transcription face against a base material softened by heating, then forcibly separating the mold from the base material to transcribe a reverse pattern of the concavo-convex pattern to the surface of the base material, wherein when assuming a temperature for pressing the mold against the base material as T1 (° C.), a temperature for separating the mold from the base materials T2 (° C.), thermal expansion coefficients of the mold and the base material as ?a and ?b, and the maximum distance between the transcription center of the transcription face and the concavo-convex pattern as d (mm), the following relations (1) and (2): T1?T2 ??(1) |?a??b|·(T1?T2)·d?4×10?2 ??(2) are simultaneously satisfied.

Abstract: A micro-shape transcription method has preparing a mold having a transcription face on which a concavo-convex pattern is formed, pressing the transcription face against a base material softened by heating, then forcibly separating the mold from the base material to transcribe a reverse pattern of the concavo-convex pattern to the surface of the base material, wherein when assuming a temperature for pressing the mold against the base material as T1 (° C.), a temperature for separating the mold from the base material as T2 (° C.), thermal expansion coefficients of the mold and the base material as ?a and ?b, and the maximum distance between the transcription center of the transcription face and the concavo-convex pattern as d (mm), the following relations (1) and (2): T1?T2 ??(1) |?a??b|·(T1?T2)·d?4×10?2 ??(2) are simultaneously satisfied.

Abstract: Based on information indicating the signal transmission amount between the first and second circuit blocks, a switching device switches an optical signal communication form which uses a first and second optical signal transmitting/receiving devices and an electric signal communication form which uses a first and second electric signal transmitting/receiving devices. Thereby, in a portable information terminal apparatus with a separate main body operation unit and a separate screen display unit, power consumed by the optical signal communication can be suppressed.

Abstract: An optical mount substrate and a manufacturing method of the optical mount substrate. An optical fiber guide section for arranging and fixing an optical transfer section, having an optical waveguide or an optical fiber, is formed. An electrical conductivity member is embedded in the optical mount substrate so that it penetrates a first principal plane of an arrangement section for arranging an optical device optically connected with the optical waveguide or the optical fiber on the first principal plane, and a second principal plane of the arrangement section parallel to the first principal plane. The optical fiber guide section and the arrangement section are formed by pressing a mold member to a heated and softened substrate to transfer inversion geometry of the mold member onto the substrate. The electrical conductivity member, having a predetermined shape, is directly pressed onto the heated and softened substrate to embed it into the substrate.

Abstract: A thin imaging apparatus with an extremely low profile captures high quality images with outstanding resolution. The imaging apparatus has a light guide, incidence mirror, imaging device, and aperture unit. The incidence mirror reflects and guides light from a subject into the light guide, and the imaging device receives the light from the subject reflected by the incidence mirror and passing through the light guide.

Abstract: An optical package substrate and a molding method therefor which provide for easy production, easy mounting of optical elements such as photodiodes and lasers, good functionality, productivity and economy, and an optical device incorporating the package substrate. On the surface of an optical package substrate, a guide groove used for the positioning of an optical fiber and a tapered face adjoining the guide groove are provided, the tapered face being formed to have a predetermined angle. A mirror for reflecting light is formed on the tapered face. An optical fiber is affixed in the guide groove. A surface reception type photodiode, which is placed in a position for receiving light deflected by the mirror, is mounted above the tapered face. By providing a positioning marker for a light receiving element on the optical package substrate, it becomes particularly easy to mount the surface reception type photodiode through passive alignment.

Abstract: Provided is a portable device having such a configuration that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device comprising: a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that the irrelative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

Abstract: In a method for forming an image of a subject on a solid-state imaging device, a first time period for splitting a light beam from a subject into a plurality of light beams that have different polarization directions and then combining the plurality of light beams to form a single subject image on the solid-state imaging device and a second time period for splitting the light beam from the subject into the plurality of light beams that have different polarization directions and forming a plurality of subject images that overlap each other partially on the solid-state imaging device are switched time-wise. A first image information on the single subject image is obtained based on pieces of signal information in the first time period, and a second image information on one of the plurality of subject images is calculated by using and computing pieces of signal information in the second time period.

Abstract: A wavelength multiplexing device has an emitter capable of independently emitting at least two optical signals for at least two kinds of wavelength, respectively and a transmitter including a plurality of optical waveguides into which the optical signals emitted by the emitter are coupled and which independently transmit the coupled optical signals, respectively. While coupling optical signals with the same wavelength among the optical signals emitted by the emitter into the optical waveguides different from each other, the transmitter couples optical signals with wavelengths different from each other into a same optical waveguide.

Abstract: Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.

Abstract: Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.

Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.

Abstract: An optical waveguide includes a first cladding, a second cladding, and a core. The core is embedded in the first cladding so as to be exposed on one principal surface of the first cladding that is opposed to the second cladding. The first cladding and the second cladding are arranged so as to sandwich the core. The core is a product formed by a reaction in which a polymeric material that includes branched polysilane and polysiloxane is subjected to at least one process selected from heating and ultraviolet irradiation. The refractive index of the core is higher than the refractive indices of the first cladding and the second cladding.

Abstract: An optical element has a substrate having or not having a channel for optical waveguide; and a material which has a refractive index higher than that of the substrate and is filled in the channel for optical waveguide or is disposed on the substrate; wherein the refractive index in a part of the material varies substantially periodically or is substantially continuously monotone increasing or decreasing in the direction of light propagation.

Abstract: When forming a laminated optical waveguide, an extra adhesive layer lies and a wave-guiding mode is present. Moreover, it is difficult to remove the adhesive layer.

Abstract: In a conventional optical device which mounts a semiconductor light emitting element, the processing is difficult and a manufacturing process cost is expensive because of the necessity of forming via holes in a substrate.

Abstract: An optical waveguide includes a first cladding, a second cladding, and a core. The core is embedded in the first cladding so as to be exposed on one principal surface of the first cladding that is opposed to the second cladding. The first cladding and the second cladding are arranged so as to sandwich the core. The core is a product formed by a reaction in which a polymeric material that includes branched polysilane and polysiloxane is subjected to at least one process selected from heating and ultraviolet irradiation. The refractive index of the core is higher than the refractive indices of the first cladding and the second cladding.