Patents by Inventor Tsuguo Inazawa

Tsuguo Inazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer ceramic coil and motor using the same
    Patent number: 7071805
    Abstract: A multilayer ceramic coil (4) for use in a compact motor is configured so that ceramic layers (4c) having a plurality of coil patterns (4a) and (4b) printed using a conductive paste are laminated, and that the coil patterns in respective layers are electrically connected via thru-holes (4d) to form a single multilayer ceramic structure having a plurality of phases of patterned-coil.
    Type: Grant
    Filed: December 2, 2002
    Date of Patent: July 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Makoto Hasegawa, Tsuguo Inazawa, Keisuke Ueda
  • Multilayer ceramic coil and motor using the same
    Publication number: 20050037183
    Abstract: Disclosed multilayer ceramic coil (4) for use in compact motor is configured that ceramic layers (4c) having a plurality of coil patterns (4a) and (4b) printed using a conductive paste are laminated, and that the coil patterns in respective layers are electrically connected via thru-holes (4d) to form a single multilayer ceramic structure having a plurality of phases of patterned-coil.
    Type: Application
    Filed: December 2, 2002
    Publication date: February 17, 2005
    Inventors: Makoto Hasegawa, Tsuguo Inazawa, Keisuke Ueda
  • Pb-free soldering alloy
    Patent number: 6692691
    Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: February 17, 2004
    Assignees: Nihon Alimit Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa
  • Pb-free soldering alloy
    Publication number: 20020015659
    Abstract: Pb-free soldering alloy that does not include any amount of Pb is proposed.
    Type: Application
    Filed: June 29, 2001
    Publication date: February 7, 2002
    Applicant: Nihon Almit Co., Ltd.
    Inventors: Tadashi Sawamura, Hisashi Komiya, Tsuguo Inazawa, Fujio Nakagawa
  • Method of forming film on electronic part metal surface having burrs
    Patent number: 5451306
    Abstract: The present invention relates to a film forming method, in which a specified electrodeposition paint composed of at least an emulsion, a gel fine particle dispersion, and a pigment paste is applied by an electrodeposition coating method to an electronic part metal surface having a burr, followed by drying and baking to form an insulating film having an average thickness of 20 to 100 .mu.m.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: September 19, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuya Nakamura, Shigenori Uda, Tsuguo Inazawa, Masaru Kikuya