Patents by Inventor Tsuguo Kurisu

Tsuguo Kurisu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Portable semiconductor device with resin
    Patent number: 5461256
    Abstract: At least one part of a two-part container of a portable semiconductor device has an electronic part accommodating portion, a foamed resin accommodating portion provided at a peripheral edge portion of the container for accommodating an excess of foamed resin, and a coupling groove for coupling the electronic part accommodating portion to the foamed resin accommodating portion. Since the electronic parts and a circuit board are completely embedded in the device, a semiconductor device exhibiting excellent resistance to environment can be manufactured by a simple process.
    Type: Grant
    Filed: November 3, 1993
    Date of Patent: October 24, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Akira Yamada, Fumiaki Baba, Syojiro Kodai, Tsuguo Kurisu, Makoto Kobayashi