Patents by Inventor Tsuguo Sakiyama

Tsuguo Sakiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for attaching semiconductors to a transparent substrate using a light-curable resin
    Patent number: 5037780
    Abstract: A method for fabricating semiconductor devices comprising pressing first and second semiconductor devices against a transparent board at different times by means of first and second pressure tools that are separate from each other and move upward and downward independent of each other so that a difference in thickness between the devices and a deflection of the devices can be absorbed and a reliable electrical connection between the electrodes of the devices and the conductors of the board can be attained, which makes it possible to continuously achieve a highly dense assembly of semiconductor devices with a minute gap therebetween.
    Type: Grant
    Filed: February 1, 1990
    Date of Patent: August 6, 1991
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Fujimoto, Kenzou Hatada, Yoshinobu Takeshita, Kazuya Otani, Koji Hidaka, Tsuguo Sakiyama