Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract: A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

Abstract: The present invention discloses a flexible printed circuit (FPC) layout and a method thereof.

Abstract: The present invention discloses a flexible printed circuit (FPC) layout and a method thereof.

Abstract: An anti-breakage structure for a transmitting end of flexible printed circuitboard (FPC) is disclosed, which comprises at least a via hole, being formed on the FPC at a position corresponding to each pin of the transmitting end while enabling the at least one via hole formed on any two neighboring pins to be arranged in a staggered manner without being align on the same line. As the via holes formed on any two neighboring pins of the FPC's transmitting end are not aligned with each other but are scattered so that the area where stress is likely to concentrate is increased when the FPC is subjected to an external force, stresses can be distributed evenly through the whole transmitting end of the FPC without forming any specific stress concentration area.