Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.

Abstract: In an embodiment, a system includes: a wafer support configured to secure a wafer; a nozzle configured to dispense a liquid or a gas on the wafer when the nozzle is in an active state of dispensing; a shutter configured to catch the liquid from the nozzle when the shutter is in a first position below the nozzle; and a shutter actuator configured to: move the shutter to the first position in response to the nozzle not being in an inactive state; move the shutter to a second position away from the first position in response to the nozzle being in the active state.

Abstract: In an embodiment, a system includes: a first robotic arm configured to transport a wafer into a cleaning chamber, wherein the first robotic arm comprises a first hood that substantially covers the wafer when transported on the first robotic arm; the cleaning chamber configured to clean the wafer; a second robotic arm configured to transport the wafer out of the cleaning chamber, wherein the second robotic arm comprises a second hood that substantially covers the wafer when transported on the second robotic arm, wherein the second robotic arm is different than the first robotic arm.

Abstract: A process for hydrogen production at lower temperature by using Mn/ZnO, Cu/MnO, Cu/CeO2, CuCe/ZnO and/or CuMn/ZnO catalysts, wherein a partial oxidization of methanol (POM) process can be initiated at an ambient reactor temperature lower than 100° C. and then undertaken at a reaction temperature lower than 200° C., and wherein POM process not only generates hydrogen rich gas (HRG) containing 4% CO or less but also generates 1.8 moles hydrogen or more per 1 mole methanol consumed.

Abstract: A process for hydrogen production at lower temperature by using Mn/ZnO, Cu/MnO, Cu/CeO2, CuCe/ZnO and/or CuMn/ZnO catalysts, wherein a partial oxidization of methanol (POM) process can be initiated at an ambient reactor temperature lower than 100° C. and then undertaken at a reaction temperature lower than 200° C., and wherein POM process not only generates hydrogen rich gas (HRG) containing 4% CO or less but also generates 1.8 moles hydrogen or more per 1 mole methanol consumed.

Abstract: A self-started process for hydrogen production, which comprises following steps: providing a gas mixture having a methanol/oxygen molar ratio less than or equal to 0.6; and conducting the gas mixture to flow through a Cu/ZnO-based catalyst bed. The Cu/ZnO-based catalyst contains copper, zinc oxide, aluminum oxide, manganese oxide and/or cerium oxide. The Cu/ZnO-based catalyst can initiate the POM reaction; then, the gas mixture will rise to a temperature of over 120° C., and the POM reaction generates a HRG at a reaction temperature of less than or equal to 180° C. The HRG contains less than 4 vol. % CO, and the POM reaction generates 1.8 moles hydrogen or more per 1 mole methanol consumed.