Patents by Inventor TSUI-WEI WENG

TSUI-WEI WENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11625487
    Abstract: A certification method, system, and computer program product include certifying an adversarial robustness of a convolutional neural network by deriving an analytic solution for a neural network output using an efficient upper bound and an efficient lower bound on an activation function and applying the analytic solution in computing a certified robustness.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: April 11, 2023
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Pin-Yu Chen, Sijia Liu, Akhilan Boopathy, Tsui-Wei Weng, Luca Daniel
  • Publication number: 20200242252
    Abstract: A certification method, system, and computer program product include certifying an adversarial robustness of a convolutional neural network by deriving an analytic solution for a neural network output using an efficient upper bound and an efficient lower bound on an activation function and applying the analytic solution in computing a certified robustness.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 30, 2020
    Inventors: Pin-Yu Chen, Sijia Liu, Akhilan Boopathy, Tsui-Wei Weng, Luca Daniel
  • Publication number: 20140062611
    Abstract: The present invention is related to a filtering device with slotted ground structure, comprising a first substrate, a second substrate and a pair of differential signal lines, in which a ground plane having slotted ground structure is provided between the first substrate and the second substrate. Each of the two differential signal lines is symmetric to each other and comprises a first line segment being horizontally provided on the top surface of the first substrate and a second line segment being horizontally provided on the bottom surface of the second substrate, respectively. The first line segment is connected to the second line segment through a vertically disposed conductive via. Thereby, a common-mode noise within a specific frequency band may be suppressed effectively, so as to avoid interference a differential-mode signal transmitted on the differential signal lines, due to the slotted ground structure etched on the ground plane.
    Type: Application
    Filed: December 14, 2012
    Publication date: March 6, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: TZONG-LIN WU, TSUI-WEI WENG, CHIH-YING HSIAO