Patents by Inventor Tsukasa Adachi
Tsukasa Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8268113Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: May 11, 2011Date of Patent: September 18, 2012Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20110214807Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: May 11, 2011Publication date: September 8, 2011Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7963308Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 16, 2006Date of Patent: June 21, 2011Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20110011541Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: September 28, 2010Publication date: January 20, 2011Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20100230030Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: February 26, 2010Publication date: September 16, 2010Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7704348Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 21, 2005Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7597774Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 21, 2005Date of Patent: October 6, 2009Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20070034332Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 16, 2006Publication date: February 15, 2007Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7137427Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: January 22, 2003Date of Patent: November 21, 2006Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060048896Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: March 9, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060037707Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: February 23, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060032583Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: February 16, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060005920Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.Type: ApplicationFiled: September 13, 2005Publication date: January 12, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
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Publication number: 20030226633Abstract: An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.Type: ApplicationFiled: June 4, 2003Publication date: December 11, 2003Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
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Publication number: 20030178134Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: January 22, 2003Publication date: September 25, 2003Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 6547616Abstract: An image display panel is prepared which has in an in-plane thereof an image display area for displaying an image and a framing area surrounding the image display area. Light shielding ink is supplied from an ink supply source to at least a partial surface area of the framing area of the image display panel. In this case, the ink supply source is made not in contact with the image display panel. Even if the frame structure of an image display device such as a liquid crystal display is made narrow, the image quality in a peripheral area of the image display area becomes hard to be lowered.Type: GrantFiled: October 13, 1998Date of Patent: April 15, 2003Assignee: Fujitsu Display Technologies CorporationInventors: Noriaki Furukawa, Taiji Yuhara, Toshiro Katsube, Satoru Imai, Tsukasa Adachi
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Patent number: 6547473Abstract: A fastening device for a conveying cart is used for fastening the conveying cart to a to-be-fastened apparatus. The device includes a flange provided on a side of the to-be-fastened apparatus, and having a pin standing therefrom, and a recess formed therein; and a fastening mechanism provided on a side of the conveying cart, and having a first hook member engaging with the pin of the flange so as to position the conveying cart with respect to the to-be-fastened apparatus, and a second hook member engaging with the recess of the flange so the to fasten the conveying cart to the to-be-fastened apparatus.Type: GrantFiled: March 16, 2001Date of Patent: April 15, 2003Assignee: Fujitsu LimitedInventors: Yukio Takayama, Akihiro Yasuda, Tsukasa Adachi
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Publication number: 20020021934Abstract: A fastening device for a conveying cart is used for fastening the conveying cart to a to-be-fastened apparatus. The device includes a flange provided on a side of the to-be-fastened apparatus, and having a pin standing therefrom, and a recess formed therein; and a fastening mechanism provided on a side of the conveying cart, and having a first hook member engaging with the pin of the flange so as to position the conveying cart with respect to the to-be-fastened apparatus, and a second hook member engaging with the recess of the flange so the to fasten the conveying cart to the to-be-fastened apparatus.Type: ApplicationFiled: March 16, 2001Publication date: February 21, 2002Applicant: Fujitsu LimitedInventors: Yukio Takayama, Akihiro Yasuda, Tsukasa Adachi
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Patent number: 6307865Abstract: The invention provides a radio communication method and a radio communication system which allow data transmission in a wide band regarding a modem modulation signal as a speech signal and allow communication at a high transmission speed without deterioration of the data quality. When a base station receives an analog signal (facsimile or data modem modulation signal) from a public network, a CS switch section connects an analog circuit interface section to a CS-PCM/CODEC section. The CS-PCM/CODEC section modulates the modem modulation signal into a PCM signal of 64 kbps, which is then demultiplexed into two signals equivalent to ADPCM signals of 32 kbps by a CS demultiplexing section. Thereafter, a CS channel CODEC section allocates the two signals equivalent to ADPCM signals of 32 kbps to two time slots and transmits the data through two radio circuits. A base station performs demodulation of received data into an analog signal by a processing procedure reverse to that by the base station.Type: GrantFiled: December 17, 1997Date of Patent: October 23, 2001Assignee: NEC CorporationInventors: Hiromichi Ogasawara, Tsukasa Adachi
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Patent number: 6009155Abstract: Terminal equipment on a reception side comprises a telephone number detection section for detecting a calling subscriber's number transmitted from the communication network, a memory for storing specified calling subscribers' numbers, and control section for calling back to the terminal equipment on the transmission side in case that it is detected in the memory by the telephone number detection section. Consequently, the terminal equipment on the transmission side promptly proceeds to a call or communication with the terminal equipment on the reception side only by dialing the telephone number of the terminal equipment on the reception side without dialing a call to the communication network, so that the terminal equipment on the transmission side can put the communication expense to an account of the terminal equipment on the reception side. It is also possible that the communication expense is put to an account of the terminal equipment on the reception side only for specified calling subscribers.Type: GrantFiled: April 15, 1997Date of Patent: December 28, 1999Assignee: NEC CorporationInventor: Tsukasa Adachi