Patents by Inventor Tsukasa Adachi

Tsukasa Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8268113
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: September 18, 2012
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20110214807
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: May 11, 2011
    Publication date: September 8, 2011
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7963308
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 21, 2011
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20110011541
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: September 28, 2010
    Publication date: January 20, 2011
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20100230030
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 16, 2010
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7704348
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: April 27, 2010
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7597774
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: October 6, 2009
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20070034332
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 16, 2006
    Publication date: February 15, 2007
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7137427
    Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: November 21, 2006
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060048896
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: March 9, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060037707
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 23, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060032583
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 16, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060005920
    Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.
    Type: Application
    Filed: September 13, 2005
    Publication date: January 12, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20030226633
    Abstract: An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
    Type: Application
    Filed: June 4, 2003
    Publication date: December 11, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20030178134
    Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 25, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 6547616
    Abstract: An image display panel is prepared which has in an in-plane thereof an image display area for displaying an image and a framing area surrounding the image display area. Light shielding ink is supplied from an ink supply source to at least a partial surface area of the framing area of the image display panel. In this case, the ink supply source is made not in contact with the image display panel. Even if the frame structure of an image display device such as a liquid crystal display is made narrow, the image quality in a peripheral area of the image display area becomes hard to be lowered.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: April 15, 2003
    Assignee: Fujitsu Display Technologies Corporation
    Inventors: Noriaki Furukawa, Taiji Yuhara, Toshiro Katsube, Satoru Imai, Tsukasa Adachi
  • Patent number: 6547473
    Abstract: A fastening device for a conveying cart is used for fastening the conveying cart to a to-be-fastened apparatus. The device includes a flange provided on a side of the to-be-fastened apparatus, and having a pin standing therefrom, and a recess formed therein; and a fastening mechanism provided on a side of the conveying cart, and having a first hook member engaging with the pin of the flange so as to position the conveying cart with respect to the to-be-fastened apparatus, and a second hook member engaging with the recess of the flange so the to fasten the conveying cart to the to-be-fastened apparatus.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: April 15, 2003
    Assignee: Fujitsu Limited
    Inventors: Yukio Takayama, Akihiro Yasuda, Tsukasa Adachi
  • Publication number: 20020021934
    Abstract: A fastening device for a conveying cart is used for fastening the conveying cart to a to-be-fastened apparatus. The device includes a flange provided on a side of the to-be-fastened apparatus, and having a pin standing therefrom, and a recess formed therein; and a fastening mechanism provided on a side of the conveying cart, and having a first hook member engaging with the pin of the flange so as to position the conveying cart with respect to the to-be-fastened apparatus, and a second hook member engaging with the recess of the flange so the to fasten the conveying cart to the to-be-fastened apparatus.
    Type: Application
    Filed: March 16, 2001
    Publication date: February 21, 2002
    Applicant: Fujitsu Limited
    Inventors: Yukio Takayama, Akihiro Yasuda, Tsukasa Adachi
  • Patent number: 6307865
    Abstract: The invention provides a radio communication method and a radio communication system which allow data transmission in a wide band regarding a modem modulation signal as a speech signal and allow communication at a high transmission speed without deterioration of the data quality. When a base station receives an analog signal (facsimile or data modem modulation signal) from a public network, a CS switch section connects an analog circuit interface section to a CS-PCM/CODEC section. The CS-PCM/CODEC section modulates the modem modulation signal into a PCM signal of 64 kbps, which is then demultiplexed into two signals equivalent to ADPCM signals of 32 kbps by a CS demultiplexing section. Thereafter, a CS channel CODEC section allocates the two signals equivalent to ADPCM signals of 32 kbps to two time slots and transmits the data through two radio circuits. A base station performs demodulation of received data into an analog signal by a processing procedure reverse to that by the base station.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: October 23, 2001
    Assignee: NEC Corporation
    Inventors: Hiromichi Ogasawara, Tsukasa Adachi
  • Patent number: 6009155
    Abstract: Terminal equipment on a reception side comprises a telephone number detection section for detecting a calling subscriber's number transmitted from the communication network, a memory for storing specified calling subscribers' numbers, and control section for calling back to the terminal equipment on the transmission side in case that it is detected in the memory by the telephone number detection section. Consequently, the terminal equipment on the transmission side promptly proceeds to a call or communication with the terminal equipment on the reception side only by dialing the telephone number of the terminal equipment on the reception side without dialing a call to the communication network, so that the terminal equipment on the transmission side can put the communication expense to an account of the terminal equipment on the reception side. It is also possible that the communication expense is put to an account of the terminal equipment on the reception side only for specified calling subscribers.
    Type: Grant
    Filed: April 15, 1997
    Date of Patent: December 28, 1999
    Assignee: NEC Corporation
    Inventor: Tsukasa Adachi