Patents by Inventor Tsukasa Fukurai

Tsukasa Fukurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing electronic device including package
    Patent number: 7320940
    Abstract: In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating process are removed by chemical polishing. A semiconductor sensor chip is inserted in the package body through the opening and fixed. Then, the lid 70 is attached to the package body.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: January 22, 2008
    Assignees: DENSO CORPORATION, Yoshikawa Kogyo Co., Ltd.
    Inventors: Tomohito Kunda, Tsukasa Fukurai
  • Method for manufacturing electronic device including package
    Publication number: 20050062067
    Abstract: In a method for manufacturing an acceleration sensor device, a lid for covering an opening of a package body is prepared by stamping. The lid is plated and plating films are formed on surfaces of the lid. The burrs formed on the surfaces of the lid in the plating process are removed by chemical polishing. A semiconductor sensor chip is inserted in the package body through the opening and fixed. Then, the lid 70 is attached to the package body.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 24, 2005
    Inventors: Tomohito Kunda, Tsukasa Fukurai